Search Results - Jiou-Kang Lee

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    Bulk-Si with poly bump process scheme for MEMS sensors

    Bulk-Si with poly bump process scheme for MEMS sensors by Chun-Wen Cheng, Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin, Hsiao Chin Tuan, Kalnitsky, A., Weileun Fang, Horsley, D. A.

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