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Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy
by
Chang, Jaewon
,
Choi, Hyunjun
,
Kim, Jinseok
,
Park, Sangkwon
,
Jo, Yoonkyeong
,
Jeong, Tae-Young
,
Soo Yeo, Myung
,
Kang, Hanbyul
,
Park, Junekyun
,
Shin, Sangchul
,
Pae, Sangwoo
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Conference Proceedings
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Subjects
Cathodes
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Current Density
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Electromigration
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Engineering
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Engineering, Electrical & Electronic
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Failure Analysis
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Resistance
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Science & Technology
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Soldering
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Stress
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Technology
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Three-Dimensional Displays
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Wafer Level Packaging
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X-Ray Microscopy
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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