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Search Results - Jongpa Hong
Search Results - Jongpa Hong
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Process optimization of micro bump pitch design in 3-dimensional package structure
by
Kim, Sun Jae
,
Kim, Hyoeun
,
Hong, Jongpa
,
Kwon, Ohguk
,
Lee, Hyoungjoo
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High Performance 3D Package Technology for Mobile Application Processor (AP)
by
Kim, Sun Jae
,
Kim, Cheol
,
Jang, Huiyeong
,
Hong, Jongpa
,
Kim, Seongyo
,
Choi, Yongwon
,
Jo, Chajea
,
Seo, Sun-Kyung
,
Kim, Dong Kwan
,
Kim, Dae-Woo
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Predicting reliability behavior in HBM packages through numerical simulation
by
O, Sangkun
,
Hong, Jongpa
,
Lee, Sangmin
,
Kyung, Seoeun
,
Lee, Junho
,
Kim, Kilsoo
,
Park, Jihyun
,
Oh, Dan
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Multiphysics modeling and design of ultralarge multiwafer MOVPE reactor for group III-nitride light emitting diodes
by
Changsung Sean Kim
,
Jongpa Hong
,
Jihye Shim
,
Yongsun Won
,
Yong-Il Kwon
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Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration
by
Kim, Min Jung
,
Lee, Seok Hyun
,
Suk, Kyoung Lim
,
Jang, Jae Gwon
,
Jeon, Gwang-Jae
,
Choi, Ju-il
,
Yun, Hyo Jin
,
Hong, Jongpa
,
Choi, Ju-Yeon
,
Lee, Won Jae
,
Jung, SukHyun
,
Choi, Won Kyoung
,
Kim, Dae-Woo
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Ieee Electronic Library (Iel) Conference Proceedings
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