Search Results - KAKUHARA, Yumi

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  1. 1
    Role of Impurity Segregation into Cu/Cap Interface and Grain Boundary in Resistivity and Electromigration of Cu/Low-$k$ Interconnects

    Role of Impurity Segregation into Cu/Cap Interface and Grain Boundary in Resistivity and Electromigration of Cu/Low-$k$ Interconnects by Yokogawa, Shinji

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  2. 2
    Degradation of Electromigration Lifetime of Cu/Low-k Interconnects by Postannealing

    Degradation of Electromigration Lifetime of Cu/Low-k Interconnects by Postannealing by Kakuhara, Yumi, Ueno, Kazuyoshi

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  3. 3
    Comparison of Lifetime Improvements in Electromigration between Ti Barrier Metal and Chemical Vapor Deposition Co Capping

    Comparison of Lifetime Improvements in Electromigration between Ti Barrier Metal and Chemical Vapor Deposition Co Capping by Kakuhara, Yumi, Yokogawa, Shinji, Ueno, Kazuyoshi

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  4. 4
    Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects

    Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects by Yokogawa, S., Kikuta, K., Tsuchiya, H., Takewaki, T., Suzuki, M., Toyoshima, H., Kakuhara, Y., Kawahara, N., Usami, T., Ohto, K., Fujii, K., Tsuchiya, Y., Arita, K., Motoyama, K., Tohara, M., Taiji, T., Kurokawa, T., Sekine, M.

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  5. 5
    Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment

    Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment by Kakuhara, Yumi, Kawahara, Naoyoshi, Ueno, Kazuyoshi, Oda, Noriaki

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  6. 6
    Suppression of Electromigration Early Failure of Cu/Porous Low- k Interconnects Using Dummy Metal

    Suppression of Electromigration Early Failure of Cu/Porous Low- k Interconnects Using Dummy Metal by Kakuhara, Yumi, Yokogawa, Shinji, Hiroi, Masayuki, Takewaki, Toshiyuki, Ueno, Kazuyoshi

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  7. 7
    Role of Impurity Segregation into Cu/Cap Interface and Grain Boundary in Resistivity and Electromigration of Cu/Low- k Interconnects

    Role of Impurity Segregation into Cu/Cap Interface and Grain Boundary in Resistivity and Electromigration of Cu/Low- k Interconnects by Yokogawa, Shinji, Kakuhara, Yumi

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  8. 8
    Reliability of damascene copper interconnects

    Reliability of damascene copper interconnects by UENO, Kazuyoshi, ISHIGAMI, Takashi, KAKUHARA, Yumi, KAWANO, Masaya

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  9. 9
    Analysis of Al Doping Effects on Resistivity and Electromigration of Copper Interconnects

    Analysis of Al Doping Effects on Resistivity and Electromigration of Copper Interconnects by Yokogawa, S., Tsuchiya, H., Kakuhara, Y., Kikuta, K.

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