Search Results - KLIMECKY, Pete

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  1. 1
    Compensation for transient chamber wall condition using real-time plasma density feedback control in an inductively coupled plasma etcher

    Compensation for transient chamber wall condition using real-time plasma density feedback control in an inductively coupled plasma etcher by Klimecky, Pete I., Grizzle, J. W., Terry, Fred L.

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  2. 2
    In situ measurements of HCl during plasma etching of poly-silicon using a diode laser absorption sensor

    In situ measurements of HCl during plasma etching of poly-silicon using a diode laser absorption sensor by Kim, Suhong, Klimecky, Pete, Jeffries, Jay B, Jr, Fred L Terry, Hanson, Ronald K

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  3. 3
    Real-time reactive ion etch metrology techniques to enable in situ response surface process characterization

    Real-time reactive ion etch metrology techniques to enable in situ response surface process characterization by KLIMECKY, Pete, GARVIN, Craig, GALARZA, Cecilia G, STUTZMAN, Brooke S, KHARGONEKAR, Pramod P, TERRY, Fred L

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  4. 4
    In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching

    In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching by BENSON, T. E, KAMLET, L. I, KLIMECKY, P, TERRY, F. L

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  5. 5
    In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etchinc

    In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etchinc by Benson, Tyrone E., Kamlet, Leonard I., Klimecky, Pete, Terry, Fred L.

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