Search Results - Kant Bajpai, Vishnu

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  1. 1
    Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

    Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications by Kant Bajpai, Vishnu, Kumar Mishra, Dileep, Dixit, Pradeep

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  2. 2
    Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging

    Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging by Bajpai, Vishnu Kant, Pandey, Harsh, Singh, Tarlochan, Dixit, Pradeep

    Published in Materials letters
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  3. 3
    Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications

    Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications by Bajpai, Vishnu Kant, Pant, Prita, Solanki, Chetan Singh

    Published in Solar energy
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  4. 4
    Effect of Light on Electroless Nickel Deposition for Solar Cell Applications

    Effect of Light on Electroless Nickel Deposition for Solar Cell Applications by Singh, Ashish Kumar, Bajpai, Vishnu Kant, Solanki, Chetan Singh

    Published in Energy procedia
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  5. 5
    Junction depth estimation using wet chemical etching for deep junction fabricated by laser doping

    Junction depth estimation using wet chemical etching for deep junction fabricated by laser doping by Mondal, Som, Bajpai, Vishnu Kant, Solanki, Chetan Singh

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