Search Results - Kao, ChengHeng Robert

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  1. 1
    Development of Ag-In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

    Development of Ag-In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices by Tsai, Chin-Hao, Huang, Wei-Chen, Kao, Chengheng Robert

    Published in Materials
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  2. 2
    Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow

    Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow by Wu, Po-Yi, Pironneau, Olivier, Shih, Po-Shao, Kao, ChengHeng Robert

    Published in Fluids (Basel)
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  3. 3
    Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study

    Dislodgement of Hydrogen Bubbles in Microchannels with Embedded Pillars: An Analytical, Experimental, and Numerical Study by Gräfner, Simon Johannes, Huang, Jeng-Hau, Wu, Po-Yi, Renganathan, Vengudusamy, Shih, Po-Shao, Kao, Chengheng Robert

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  4. 4
    A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications

    A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications by Huang, Jeng-Hau, Shih, Po-Shao, Renganathan, Vengudusamy, Gräfner, Simon Johannes, Lin, Yu-Chun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Kao, Chengheng Robert

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  5. 5
    Optimizing the wire-bonding parameters for second bonds in ball grid array packages

    Optimizing the wire-bonding parameters for second bonds in ball grid array packages by Ho, Cheng En, Chen, Chi, Kao, Chengheng Robert

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