Search Results - Kawahara, Naoyoshi

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  1. 1
    Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment

    Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment by Kakuhara, Yumi, Kawahara, Naoyoshi, Ueno, Kazuyoshi, Oda, Noriaki

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  2. 2
    Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects

    Tradeoff Characteristics Between Resistivity and Reliability for Scaled-Down Cu-Based Interconnects by Yokogawa, S., Kikuta, K., Tsuchiya, H., Takewaki, T., Suzuki, M., Toyoshima, H., Kakuhara, Y., Kawahara, N., Usami, T., Ohto, K., Fujii, K., Tsuchiya, Y., Arita, K., Motoyama, K., Tohara, M., Taiji, T., Kurokawa, T., Sekine, M.

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    Time-Dependent Dielectric Breakdown Characterization of 90- and 65-nm-Node Cu/SiOC Interconnects with Via Plugs

    Time-Dependent Dielectric Breakdown Characterization of 90- and 65-nm-Node Cu/SiOC Interconnects with Via Plugs by Ueno, Kazuyoshi, Kameyama, Akiko, Matsumoto, Akira, Iguchi, Manabu, Takewaki, Toshiyuki, Oshida, Daisuke, Toyoshima, Hironori, Kawahara, Naoyoshi, Asada, Susumu, Suzuki, Mieko, Oda, Noriaki

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