Search Results - Kejun Zeng

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  1. 21
    Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad

    Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad by Zeng, Kejun, Williamson, Jaimal

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  2. 22
    Knowledge Reasoning Method for Military Decision Support Knowledge Graph Mixing Rule and Graph Neural Networks Learning together

    Knowledge Reasoning Method for Military Decision Support Knowledge Graph Mixing Rule and Graph Neural Networks Learning together by Nie, Kai, Zeng, Kejun, Meng, Qinghai

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  3. 23
    Effect of Cu content on the interfacial reliability of SnAgCu solder joints

    Effect of Cu content on the interfacial reliability of SnAgCu solder joints by Kejun Zeng, Holdford, B

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  4. 24
    System-Level Reliability Case Studies of High-Performance Automotive and Medical IC Packages

    System-Level Reliability Case Studies of High-Performance Automotive and Medical IC Packages by Jiang, Li, Li, Guangxu, Zeng, Kejun, Williamson, Jaimal, Murugan, Rajen

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  5. 25
    TaC as a diffusion barrier between Si and Cu

    TaC as a diffusion barrier between Si and Cu by Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Iikka

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  6. 26
    Foreword

    Foreword by Guo, Fu, Handwerker, Carol A., Chada, Srinivas, Hua, Fay, Zeng, Kejun

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  7. 27
    Foreword

    Foreword by Guo, Fu, Handwerker, Carol A, Chada, Srinivas, Hua, Fay, Zeng, Kejun

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  8. 28
    Foreword

    Foreword by Chen, Chih-Ming, Chada, Srinivas, Chen, Sinn-Wen, Flandorfer, Hans, Greer, A Lindsay, Lee, Jae-Ho, Zeng, Kejun, Yen, Yee-Wen, Gierlotka, Wojciech, Wang, Chao-Hong

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  9. 29
    Foreword

    Foreword by Guo, Fu, Handwerker, Carol A., Chada, Srinivas, Hua, Fay, Zeng, Kejun

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  10. 30
    Thermodynamic modeling of the laves phases in the CrZr system

    Thermodynamic modeling of the laves phases in the CrZr system by Zeng, Kejun, Marko, Hämäläinen, Kaj, Lilius

    Published in Calphad
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  11. 31
    Foreword

    Foreword by Chen, Sinn-wen, Chada, Srinivas, Chen, Chih-ming, Flandorfer, Hans, Greer, A Lindsay, Lee, Jae-Ho, Zeng, Kejun, Suganuma, Katsuaki

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  12. 32
    Foreword

    Foreword by Chen, Sinn-wen, Chada, Srinivas, Chen, Chih-ming, Flandorfer, Hans, Lindsay Greer, A., Lee, Jae-Ho, Zeng, Kejun, Suganuma, Katsuaki

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  13. 33
    Foreword

    Foreword by Chen, Sinn-wen, Chada, Srinivas, Chen, Chih-ming, Flandorfer, Hans, Lindsay Greer, A., Lee, Jae-Ho, Zeng, Kejun, Suganuma, Katsuaki

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  14. 34
    Foreword

    Foreword by Chen, Chih-ming, Chada, Srinivas, Chen, Sinn-wen, Flandorfer, Hans, Lindsay Greer, A., Lee, Jae-ho, Zeng, Kejun, Yen, Yee-wen, Gierlotka, Wojciech, Wang, Chao-hong

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  15. 35
    Foreword

    Foreword by Chen, Chih-ming, Chada, Srinivas, Chen, Sinn-wen, Flandorfer, Hans, Greer, A Lindsay, Lee, Jae-ho, Zeng, Kejun, Yen, Yee-wen, Gierlotka, Wojciech, Wang, Chao-hong

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  16. 36
    Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating

    Root Cause of Black Pad Failure of Solder Joints with Electroless Nickel/Immersion Gold Plating by Kejun Zeng, Stierman, R., Abbott, D., Murtuza, M.

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  17. 37
    The ternary system Al–Ni–Ti Part I: Isothermal section at 900°C; Experimental investigation and thermodynamic calculation

    The ternary system Al–Ni–Ti Part I: Isothermal section at 900°C; Experimental investigation and thermodynamic calculation by Huneau, B., Rogl, P., Zeng, K., Schmid-Fetzer, R., Bohn, M., Bauer, J.

    Published in Intermetallics
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  18. 38
    Foreword

    Foreword by Chen, Chih-ming, Chada, Srinivas, Chen, Sinn-wen, Flandorfer, Hans, Lindsay Greer, A., Lee, Jae-ho, Zeng, Kejun, Yen, Yee-wen, Gierlotka, Wojciech, Wang, Chao-hong

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  19. 39
    Foreword

    Foreword by Kang, Sung K., Anderson, Iver, Chada, Srini, Duh, Jeng-Gong, Turbini, Laura J., Wu, Albert, Kao, C. Robert, Hua, Fay, Subramanian, K. N., Frear, Darrel, Handwerker, Carol, Guo, Fu, Chawla, Nik, Zeng, Kejun

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  20. 40
    Foreword

    Foreword by Kang, Sung K, Anderson, Iver, Chada, Srini, Duh, Jeng-Gong, Turbini, Laura J, Wu, Albert, Kao, C Robert, Hua, Fay, Subramanian, K N, Frear, Darrel, Handwerker, Carol, Guo, Fu, Chawla, Nik, Zeng, Kejun

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