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Metal Plating on Mold Compound for EMI Shielding with Industrial Test Compliance
by
Tai, Min Fee
,
Kok, Swee Leong
,
Lee, Swee Kah
,
Goh, Soon Lock
,
Mukai, Kenichiroh
,
Kim, Ken
Published in
Transactions on electrical and electronic materials
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Robust Fuzzy On–Off Synthesis Controller for Maximum Power Point Tracking of Wind Energy Conversion
by
Min Fee Tai
,
Swee Leong Kok
,
Swee Kah Lee
,
Soon Lock Goh
,
Kenichiroh Mukai
,
Ken Kim
Published in
Transactions on electrical and electronic materials
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Adhesive enabling technology for directly plating metal on molding compound
by
Mukai, Kenichiroh
,
Brandt, Tafadzwa Magaya Lutz
,
Kim, Kwonil
,
Eastep, Brian
,
Gaherty, Lee
,
Kashyap, Anirudh
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Adhesive enabling technology for directly plating copper onto glass
by
Mukai, Kenichiroh
,
Magaya, Tafadzwa
,
Brandt, Lutz
,
Zhiming Liu
,
Fu, Hailuo
,
Hunegnaw, Sara
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Adhesive enabling technology for directly plating metal on molding resin
by
Kwonil Kim
,
Mukai, Kenichiroh
,
Eastep, Brian
,
Gaherty, Lee
,
Kashyap, Anirudh
,
Brandt, Lutz
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Transactions On Electrical And Electronic Materials
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Adhesives
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Copper
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Reliability
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Science & Technology
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Technology
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Chemistry And Materials Science
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Compounds
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Electromagnetic Interference
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Electronics And Microelectronics
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Emi Shielding
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Engineering
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Engineering, Electrical & Electronic
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Glass
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Instrumentation
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Materials Science
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Materials Science, Multidisciplinary
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Mold Compound
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Optical And Electronic Materials
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Plating
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