Search Results - KeonTaek Kang

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  1. 1
    Advanced Packaging Need for Automotive In-cabin Application

    Advanced Packaging Need for Automotive In-cabin Application by Islam, Nokibul, Ming-Che Hsieh, Kang KeonTaek

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  2. 2
    Development of thin flip chip package with low cost substrate technology

    Development of thin flip chip package with low cost substrate technology by Ming-Che Hsieh, NamJu Cho, KeonTaek Kang

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  3. 3
    Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip Package

    Various Chip Attach Evaluations in a Fine Bump Pitch and Substrate Flip Chip Package by ChiYuan Chen, Hsu, Ian, Lin, Stanley, KeonTaek Kang, Ming-Che Hsieh

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  4. 4
    Thin profile flip chip package-on-package development

    Thin profile flip chip package-on-package development by Ming-Che Hsieh, KeonTaek Kang, HangChul Choi, YoungCheol Kim

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  5. 5
    Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-out Mediatek Innovation Package) Technology

    Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-out Mediatek Innovation Package) Technology by Hsu, Ian, Chen, Chi-Yuan, Lin, Stanley, Yu, Ta-Jen, Hsieh, Ming-Che, Kang, KeonTaek, Yoon, Seung Wook

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