Search Results - Kicin, Slavo

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  1. 1
    Characterization of a Silicon IGBT and Silicon Carbide MOSFET Cross-Switch Hybrid

    Characterization of a Silicon IGBT and Silicon Carbide MOSFET Cross-Switch Hybrid by Rahimo, Munaf, Canales, Francisco, Minamisawa, Renato Amaral, Papadopoulos, Charalampos, Vemulapati, Umamaheswara, Mihaila, Andrei, Kicin, Slavo, Drofenik, Uwe

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  2. 2
    Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods

    Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods by Lis, Adrian, Kicin, Slavo, Brem, Franziska, Leinenbach, Christian

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  3. 3
    Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods

    Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods by Lis, Adrian, Kicin, Slavo, Brem, Franziska, Leinenbach, Christian

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  4. 4
    PCB Embedded Semiconductors for Low-Voltage Power Electronic Applications

    PCB Embedded Semiconductors for Low-Voltage Power Electronic Applications by Kearney, Daniel J., Kicin, Slavo, Bianda, Enea, Krivda, Andrej

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  5. 5
    A new concept of a high-current power module allowing paralleling of many SiC devices assembled exploiting conventional packaging technologies

    A new concept of a high-current power module allowing paralleling of many SiC devices assembled exploiting conventional packaging technologies by Kicin, Slavo, Traub, Felix, Hartmann, Samuel, Bianda, Enea, Bernhard, Christof, Skibin, Stanislav, Canales, Francisco

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  6. 6
    Low-Voltage AC Drive Based on Double-Sided Cooled IGBT Press-Pack Modules

    Low-Voltage AC Drive Based on Double-Sided Cooled IGBT Press-Pack Modules by Kicin, S., Laitinen, M., Haederli, C., Sikanen, J., Grinberg, R., Chunlei Liu, Fabian, J.-H, Hamidi, A.

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  7. 7
    Assessment of selected materials and assembly technologies for power electronics modules with the capability to operate at high temperatures

    Assessment of selected materials and assembly technologies for power electronics modules with the capability to operate at high temperatures by Kicin, Slavo, Hamers, Joris

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  8. 8
    Full SiC half-bridge module for high frequency and high temperature operation

    Full SiC half-bridge module for high frequency and high temperature operation by Kicin, Slavo, Pettersson, Sami, Bianda, Enea, Canales, Francisco, Cottet, Didier, Cavallini, Giacomo, Hamers, Joris

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  9. 9
    Full silicon carbide boost chopper module for high frequency and high temperature operation

    Full silicon carbide boost chopper module for high frequency and high temperature operation by Pettersson, Sami, Kicin, Slavo, Holm, Toni, Bianda, Enea, Canales, Francisco

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  10. 10
    Performance evaluation of custom-made 1.2-kV 100-A silicon carbide half-bridge module in three-phase grid connected PWM rectifier

    Performance evaluation of custom-made 1.2-kV 100-A silicon carbide half-bridge module in three-phase grid connected PWM rectifier by Pettersson, Sami, Kicin, Slavo, Bianda, Enea, Holm, Toni, Raisanen, Paula, Canales, Francisco

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