Search Results - Kim, Hanglim

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  1. 1
    Polyimide–Epoxy Composites with Superior Bendable Properties for Application in Flexible Electronics

    Polyimide–Epoxy Composites with Superior Bendable Properties for Application in Flexible Electronics by Lee, Sangyoup, Yoo, Taewon, Han, Youngyu, Kim, Hanglim, Han, Haksoo

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  2. 2
    Catalytic nickel silicide as an alternative to noble metals in metal-assisted chemical etching of silicon

    Catalytic nickel silicide as an alternative to noble metals in metal-assisted chemical etching of silicon by Kim, Kyunghwan, Choi, Sunhae, Bong, Haekyun, Lee, Hanglim, Kim, Minyoung, Oh, Jungwoo

    Published in Nanoscale
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  3. 3
    Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing

    Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing by Lee, Youngseok, You, Yebin, Cho, Chulhee, Kim, Sijun, Lee, Jangjae, Kim, Minyoung, Lee, Hanglim, You, Youngjun, Kim, Kyungman, You, ShinJae

    Published in Micromachines (Basel)
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  4. 4
    Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO[sub.2] Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing

    Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO[sub.2] Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing by Lee, Youngseok, You, Yebin, Cho, Chulhee, Kim, Sijun, Lee, Jangjae, Kim, Minyoung, Lee, Hanglim, You, Youngjun, Kim, Kyungman, You, ShinJae

    Published in Micromachines (Basel)
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