Search Results - Kim, Yi-Ram

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  1. 1
    Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer

    Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer by Madanipour, Hossein, Kim, Yi-Ram, Kim, Choong-Un, Mishra, Dibyajat, Thompson, Patrick

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  2. 2
    Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition

    Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition by Ram Kim, Yi, Osmanson, Allison T., Kim, Choong-Un, Thompson, Patrick F., Chen, Qiao

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  3. 3
    Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects

    Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects by Kim, Yi Ram, Osmanson, Allison T., Madanipour, Hossein, Kim, Choong-Un, Thompson, Patrick F., Chen, Qiao

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  4. 4
    Electromigration Effect on the Pd Coated Cu Wirebond

    Electromigration Effect on the Pd Coated Cu Wirebond by Tajedini, Mohsen, Osmanson, Allison Theresa, Kim, Yi Ram, Madanipour, Hossein, Kim, Choong-Un, Glasscock, Bradley, Khan, Muhammad

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  5. 5
    Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing

    Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing by Osmanson, Allison T., Kim, Yi Ram, Kim, Choong-Un, Thompson, Patrick F., Chen, Qiao, Ankamah-Kusi, Sylvester

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  6. 6
    Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects

    Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects by Kim, Yi Ram, Madanipour, Hossein, Osmanson, Allison T., Tajedini, Mohsen, Kim, Choong-Un, Thompson, Patrick F., Chen, Qiao

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  7. 7
    Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition

    Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition by Kim, Yi Ram, Osmanson, Allison T., Madanipou, Hossein, Kim, Choong-Un, Thompson, Patrick F., Chen, Qiao

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  8. 8
    Ex vivo relaxation effect of Cuscuta chinensis extract on rabbit corpus cavernosum

    Ex vivo relaxation effect of Cuscuta chinensis extract on rabbit corpus cavernosum by Sun, Kai, Zhao, Chen, Chen, Xiang-Feng, Kim, Hye-Kyung, Choi, Bo-Ram, Huang, Yi-Ran, Park, Jong-Kwan

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  9. 9
    Association between MKRN3 and LIN28B polymorphisms and precocious puberty

    Association between MKRN3 and LIN28B polymorphisms and precocious puberty by Yi, Bo Ram, Kim, Hyun Jeong, Park, Hye Sook, Cho, Yoon Jeong, Kim, Ju Young, Yee, Jeong, Chung, Jee Eun, Kim, Joo Hee, Lee, Kyung Eun, Gwak, Hye Sun

    Published in BMC genetics
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  10. 10
    Nursing Frequency, Nursing Time, and Nursing Intervention Priorities depending on Neonatal Therapeutic Hypothermia Methods

    Nursing Frequency, Nursing Time, and Nursing Intervention Priorities depending on Neonatal Therapeutic Hypothermia Methods by Kim, Dong Yeon, Jo, Kyung A, Yi, Bo Ram, Park, Ho Ran

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