Search Results - Kim Yong Goh

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  1. 1
    Micromechanical analysis of copper trace in printed circuit boards

    Micromechanical analysis of copper trace in printed circuit boards by Hu, Guojun, Goh Kim, Yong, Judy, Lim

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  2. 2
    Robust power package development with mechanical simulation and reliability validation

    Robust power package development with mechanical simulation and reliability validation by Xueren Zhang, Kim-yong Goh, Yiyi Ma, Wingshenq Wong

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  3. 3
    Challenges for extra large embedded wafer level ball grid array development

    Challenges for extra large embedded wafer level ball grid array development by Jing-en Luan, Yonggang Jin, Kim-yong Goh, Yiyi Ma, Guojun Hu, Yaohuang Huang, Baraton, X.

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  4. 4
    A novel methodology for virtual qualification of IC packages under board level drop test

    A novel methodology for virtual qualification of IC packages under board level drop test by Luan Jing-en, Kim-yong Goh, Baraton, X.

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  5. 5
    Design for Improvement of Drop Impact Performance of IC Packages

    Design for Improvement of Drop Impact Performance of IC Packages by Jing-en Luan, Kim-yong Goh

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  6. 6
    Camera Module Design, Assembly and Test Challenges

    Camera Module Design, Assembly and Test Challenges by Jing-en Luan, Baraton, X., Wingshenq Wong, Kim-yong Goh, Yap, D.

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  7. 7
    On the drop impact performance of IPDTM devices with different process technologies

    On the drop impact performance of IPDTM devices with different process technologies by Yiyi Ma, Kim-Yong Goh, Xueren Zhang, Wei-Zhen Goh

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  8. 8
    Copper wirebond pull test and reliability characterization with finite element simulation

    Copper wirebond pull test and reliability characterization with finite element simulation by Xueren Zhang, Teysseyre, J., Kim-Yong Goh, Wingshenq Wong

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  9. 9
    Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages

    Study of JEDEC B-condition JESD22-B111 standard for drop test reliability of Chip Scale Packages by Bentata, Y., Forster, S., Kim Yong Goh, Fremont, H.

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  10. 10
    Thermoelastic properties of printed circuit boards: Effect of copper trace

    Thermoelastic properties of printed circuit boards: Effect of copper trace by Hu Guojun, Goh Kim Yong, Luan Jing-en, Lim Wee Chin, Baraton, X.

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  11. 11
    Drop impact life model development for FBGA assembly with lead-free solder joint

    Drop impact life model development for FBGA assembly with lead-free solder joint by Faxing Che, Jing-En Luan, Kim Yong Goh, Baraton, X.

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  12. 12
    Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder

    Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder by Fa-Xing Che, Jing-En Luan, Yap, Daniel, Kim-Yong Goh, Baraton, Xavier

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  13. 13
    Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods

    Design for Cyclic Bending Reliability of Large PBGA Assembly Using Experimental and Numerical Methods by Fa Xing Che, Yap, D., Jing En Luan, Kim Yong Goh, Yi Yi Ma

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  14. 14
    Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA

    Absolute and relative fatigue life prediction methodology for virtual qualification and design enhancement of lead-free BGA by Hun Shen Ng, Tong Yan Tee, Kim Yong Goh, Jing-en Luan, Reinikainen, T., Hussa, E., Kujala, A.

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  15. 15
    Drop impact life prediction model for lead-free BGA packages and modules

    Drop impact life prediction model for lead-free BGA packages and modules by Jing-en Luan, Tong Yan Tee, Kim Yong Goh, Hun Shen Ng, Baraton, X., Bronner, R., Sorrieul, M., Hussa, E., Reinikainen, T., Kujala, A.

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  16. 16
    Drop impact life prediction model for wafer level chip scale packages

    Drop impact life prediction model for wafer level chip scale packages by Kim Yong Goh, Jing-en Luan, Tong Yan Tee

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  17. 17
    4-dimensional design analysis and optimization of system-in-package

    4-dimensional design analysis and optimization of system-in-package by Tong Yan Tee, Hun Shen Ng, Jing-en Luan, Xueren Zhang, Kim Yong Goh, Grech, A.M., Duca, R.

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  18. 18
    Cardiovascular Events Associated With SGLT-2 Inhibitors Versus Other Glucose-Lowering Drugs: The CVD-REAL 2 Study

    Cardiovascular Events Associated With SGLT-2 Inhibitors Versus Other Glucose-Lowering Drugs: The CVD-REAL 2 Study by Kosiborod, Mikhail, Lam, Carolyn S P, Kohsaka, Shun, Kim, Dae Jung, Karasik, Avraham, Shaw, Jonathan, Tangri, Navdeep, Goh, Su-Yen, Thuresson, Marcus, Chen, Hungta, Surmont, Filip, Hammar, Niklas, Fenici, Peter

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  19. 19
    Macrophages in wound healing: activation and plasticity

    Macrophages in wound healing: activation and plasticity by Kim, Sang Yong, Nair, Meera G

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  20. 20
    Artificial intelligence in sepsis early prediction and diagnosis using unstructured data in healthcare

    Artificial intelligence in sepsis early prediction and diagnosis using unstructured data in healthcare by Goh, Kim Huat, Wang, Le, Yeow, Adrian Yong Kwang, Poh, Hermione, Li, Ke, Yeow, Joannas Jie Lin, Tan, Gamaliel Yu Heng

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