Search Results - Kini, Sumanth

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  1. 1
    Novel methods for SPC defect monitoring: Normalizable diversity sampling: Defect inspection

    Novel methods for SPC defect monitoring: Normalizable diversity sampling: Defect inspection by Tolle, Ian, Jain, Ankit, Plihal, Martin, Kini, Sumanth

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  2. 2
    Line end voids defectivity improvement on 64 pitch Cu wire interconnects of 14 nm technology

    Line end voids defectivity improvement on 64 pitch Cu wire interconnects of 14 nm technology by Daino, Michael, Jensen, Graham, Jain, Ankit, Kini, Sumanth, Bawari, Atul, Rajagopalan, Balajee, Aizawa, Hirokazu, Jae Choo, Srivastava, Amit, Tolle, Ian, Huang, Ronald, Shiran Xiao, Hoang Nguyen

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  3. 3
    Non-traditional inspection strategy for inline monitoring in excursion scenarios: Defect inspection

    Non-traditional inspection strategy for inline monitoring in excursion scenarios: Defect inspection by Srivastava, Amit, Tolle, Ian, Mraz, Aleister, Gupta, Sachin, Huang, Ronald, Hoang Nguyen, Dey, Liton, Jain, Ankit, Sang-Hyun Lee, Kini, Sumanth

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  4. 4
    Process Window Centering for 22 nm Lithography

    Process Window Centering for 22 nm Lithography by Buengener, Ralf, Boye, Carol, Rhoads, Bryan N, Chong, Sang Y, Tejwani, Charu, Burns, Sean D, Stamper, Andrew D, Nafisi, Kourosh, Brodsky, Colin J, Fan, Susan S, Kini, Sumanth, Hahn, Roland

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  5. 5
    Process Window Centering for 22 nm lithography

    Process Window Centering for 22 nm lithography by Buengener, Ralf, Boye, C, Rhoads, B N, Chong, S Y, Tejwani, C, Burns, S D, Stamper, A D, Nafisi, K, Brodsky, C J, Fan, S S, Kini, S, Hahn, R

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  6. 6
    Optimization of pitch-split double patterning phoresist for applications at the 16nm node

    Optimization of pitch-split double patterning phoresist for applications at the 16nm node by Holmes, S. J., Tang, C., Burns, S., Yunpeng Yin, Chen, R., Chiew-seng Koay, Kini, S., Tomizawa, H., Shyng-Tsong Chen, Fender, N., Osborn, B., Singh, L., Petrillo, K., Landie, G., Halle, S., Sen Liu, Arnold, J. C., Spooner, T., Varanasi, R., Slezak, M., Colburn, M., Dunn, S., Hetzer, D., Kawakami, S., Cantone, J.

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  7. 7
    Defectivity Characterization of post-CMP Voiding in 32nm Cu Metallization

    Defectivity Characterization of post-CMP Voiding in 32nm Cu Metallization by Boye, C.A., Kelly, J.J., Canaperi, D.

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  8. 8
    Human dirofilariasis: an emerging zoonosis in India

    Human dirofilariasis: an emerging zoonosis in India by Kini, Reshma G., Leena, J. B., Shetty, Prathvi, Lyngdoh, Raphael Hart, Sumanth, D., George, Lovely

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