Search Results - Kinyanjui, R.K.

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  1. 1
    Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories

    Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories by Lehman, L.P., Kinyanjui, R.K., Zavalij, L., Zribi, A., Cotts, E.J.

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    Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

    Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints by Lehman, L.P., Kinyanjui, R.K., Wang, J., Xing, Y., Zavalij, L., Borgesen, P., Cotts, E.J.

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    Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate

    Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate by Kinyanjui, R.K., Zribi, A., Cotts, E.J.

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