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Thermal management in TSV based 3D IC Integration: A survey
by
Kiran Sanipini, Venkata
,
Rakesh, Banothu
,
Jyothi Chamanthula, Aruna
,
Santoshi, N.
,
Arunkumar Gudivada, A.
,
Kumar Panigrahy, Asisa
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3D Ic
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Graphene
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Hotspot
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Materials Science
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Materials Science, Multidisciplinary
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Science & Technology
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Thermal Management
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Thermal Tsvs
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Through Silicon Vias
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