Fístula Arteriovenosa Traumática de Artéria Ilíaca Interna como Causa de Hemorragia Digestiva: Relato de Caso by Ulguim, C. K., Vieira, A. H. B. G., Klais, A. L. M., Brenner, A. S., Invitti, H. L., Araujo, K. W. C. S., Valarini, R.

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Expression of single-chain antibody against RgpA protease of Porphyromonas gingivalis in Lactobacillus by Marcotte, H, Kõll-Klais, P, Hultberg, A, Zhao, Y, Gmür, R, Mändar, R, Mikelsaar, M, Hammarström, L

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Oral lactobacilli in chronic periodontitis and periodontal health: species composition and antimicrobial activity by Kõll-Klais, P., Mändar, R., Leibur, E., Marcotte, H., Hammarström, L., Mikelsaar, M.

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The nature and frequency of neovascular age-related macular degeneration by Iranmanesh, R, Eandi, C M, Peiretti, E, Klais, C M, Garuti, S, Goldberg, D E, Slakter, J S, Yannuzzi, L A

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Photoscreening for diabetic retinopathy: a comparison of image quality between film photography and digital imaging by Klais, Christina MC, Grupchev, Ivan D, McGhee, Charles NJ, Donaldson, Mark L

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Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies by Su, L.T., Pellerin, J., Huang, S.F., Khare, M., Schepis, D., Rim, K., Liming, S., Waite, A., Sato, T., Panda, S., Nii, H., Lee, W., Holt, J., Fried, D., Chidambarrao, D., Chen, H., Kepler, N., Raab, M., Greenlaw, D., Stephan, R., Hubler, P., Ruelke, H., Herzog, O., Engelmann, H.-J., Schaller, M., Salz, H., Trui, B., Trentsch, M., Reichel, C., Press, P., Otterbach, R., Neu, A., Lenski, M., Koerner, G., Klais, J., Javorka, P., Hohage, J., Hempel, K., Hellmich, A., Gerhardt, M., Frohberg, K., Feudel, T., Bierstedt, H., Hontschel, J., Kammler, T., Wei, A., Horstmann, M.

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High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL by Lee, W.-H., Waite, A., Nii, H., Nayfeh, H.M., McGahay, V., Nakayama, H., Fried, D., Chen, H., Black, L., Bolam, R., Cheng, J., Chidambarrao, D., Christiansen, C., Cullinan-Scholl, M., Davies, D.R., Domenicucci, A., Fisher, P., Fitzsimmons, J., Gill, J., Gribelyuk, M., Harmon, D., Holt, J., Ida, K., Kiene, M., Kluth, J., Labelle, C., Madan, A., Malone, K., McLaughlin, P.V., Minami, M., Mocuta, D., Murphy, R., Muzzy, C., Newport, M., Panda, S., Peidous, I., Sakamoto, A., Sato, T., Sudo, G., VanMeer, H., Yamashita, T., Zhu, H., Agnello, P., Bronner, G., Freeman, G., Huang, S.-F., Ivers, T., Luning, S., Miyamoto, K., Nye, H., Pellerin, J., Rim, K., Schepis, D., Spooner, T., Chen, X., Khare, M., Horstmann, M., Wei, A., Kammler, T., Hontschel, J., Bierstedt, H., Engelmann, H.-J., Hellmich, A., Hempel, K., Koerner, G., Neu, A., Otterbach, R., Reichel, C., Trentsch, M., Press, P., Frohberg, K., Schaller, M., Salz, H., Hohage, J., Ruelke, H., Klais, J., Raab, M., Greenlaw, D., Kepler, N.

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Dual stress liner for high performance sub-45nm gate length SOI CMOS manufacturing by Yang, H.S., Malik, R., Narasimha, S., Li, Y., Divakaruni, R., Agnello, P., Allen, S., Antreasyan, A., Arnold, J.C., Bandy, K., Belyansky, M., Bonnoit, A., Bronner, G., Chan, V., Chen, X., Chen, Z., Chidambarrao, D., Chou, A., Clark, W., Crowder, S.W., Engel, B., Harifuchi, H., Huang, S.F., Jagannathan, R., Jamin, F.F., Kohyama, Y., Kuroda, H., Lai, C.W., Lee, H.K., Lee, W.-H., Lim, E.H., Lai, W., Mallikarjunan, A., Matsumoto, K., McKnight, A., Nayak, J., Ng, H.Y., Panda, S., Rengarajan, R., Steigerwalt, M., Subbanna, S., Subramanian, K., Sudijono, J., Sudo, G., Sun, S.-P., Tessier, B., Toyoshima, Y., Tran, P., Wise, R., Wong, R., Yang, I.Y., Wann, C.H., Su, L.T., Horstmann, M., Feudel, Th, Wei, A., Frohberg, K., Burbach, G., Gerhardt, M., Lenski, M., Stephan, R., Wieczorek, K., Schaller, M., Salz, H., Hohage, J., Ruelke, H., Klais, J., Huebler, P., Luning, S., van Bentum, R., Grasshoff, G., Schwan, C., Ehrichs, E., Goad, S., Buller, J., Krishnan, S., Greenlaw, D., Raab, M., Kepler, N.

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