Transmission enhancement in an array of subwavelength slits in aluminum due to surface plasmon resonances by Chan, Ho Bun, Marcet, Zsolt, Carr, Dustin, Bower, John Eric, Cirelli, Ray, Ferry, Ed, Klemens, Fred P., Miner, John F., Pai, Chien-Shing, Taylor, J. Ashley

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Air-gaps in 0.3 μm electrical interconnections by Kohl, P.A., Bhusari, D.M., Wedlake, M., Case, C., Klemens, F.P., Miner, J., Byung-Chan Lee, Gutmann, R.J., Shick, R.

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Monolithic fringe-field-activated crystalline silicon tilting-mirror devices by Greywall, D.S., Chien-Shing Pai, Sang-Hyun Oh, Chorng-Ping Chang, Marom, D.M., Busch, P.A., Cirelli, R.A., Taylor, J.A., Klemens, F.P., Sorsch, T.W., Bower, J.E., Lai, W.Y.-C., Soh, H.T.

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Interleaver Using an Arrayed-Waveguide Grating-Lens-Grating Configuration for Spectrally Efficient Systems by Doerr, C.R., Buhl, L.L., Cappuzzo, M.A., Chen, E.Y., Gomez, L.T., Klemens, F.P., Keller, R.C.

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Free-space coherent optical communication with orbital angular, momentum multiplexing/demultiplexing using a hybrid 3D photonic integrated circuit by Guan, Binbin, Scott, Ryan P, Qin, Chuan, Fontaine, Nicolas K, Su, Tiehui, Ferrari, Carlo, Cappuzzo, Mark, Klemens, Fred, Keller, Bob, Earnshaw, Mark, Yoo, S J B

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Single-element elliptical hard x-ray micro-optics by Evans-Lutterodt, Kenneth, Ablett, James, Stein, Aaron, Kao, Chi-Chang, Tennant, Don, Klemens, Fred, Taylor, Ashley, Jacobsen, Chris, Gammel, Peter, Huggins, Harold, Bogart, Greg, Ustin, Scott, Ocola, Leo

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Reconfigurable Linear Optical FM Discriminator by Rasras, M. S., Chen, Y., Kun-Yii Tu, Earnshaw, M. P., Pardo, F., Cappuzzo, M. A., Chen, E. Y., Gomez, L. T., Klemens, F., Keller, B., Bolle, C., Buhl, L., Wyrwas, J. M., Wu, M. C., Peach, R., Meredith, S., Middleton, C., DeSalvo, R.

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Integrated optical orbital angular momentum multiplexing device using 3-D waveguides and a silica PLC by Binbin Guan, Scott, Ryan P., Fontaine, Nicolas K., Su, Tiehui, Ferrari, Carlo, Cappuzzo, Mark, Klemens, Fred, Keller, Bob, Earnshaw, Mark, Yoo, S. J. B.

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Free-Space Coherent Optical Communication Demonstration using a 3D Photonic Integrated Circuit Device for Orbital Angular Momentum Multiplexing/Demultiplexing by Scott, R.P, Binbin Guan, Chuan Qin, Fontaine, N.K, Tiehui Su, Ferrari, C, Cappuzzo, M, Klemens, F, Keller, B, Earnshaw, M, Yoo, S.J.B

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High-Density Solder Bump Interconnect for MEMS Hybrid Integration by Basavanhally, N., Lopez, D., Aksyuk, V., Ramsey, D., Bower, E., Cirelli, R., Ferry, E., Frahm, R., Gates, J., Klemens, F., Lai, W., Low Yee, Mansfield, W., Chien-Shing Pai, Papazian, R., Pardo, F., Sorsch, T., Watson, P.

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News & views by Ade, H., Hitchcock, A. P., Mitchell, G. E., Kilcoyne, A. L. D., Tyliszczak, T., Fink, R., Warwick, T., Evans‐Lutterodt, Kenneth, Stein, Aaron, Ablett, James M., Kao, And Chi‐Chang, Tennant, Don M., Klemens, Fred, Taylor, Ashley, Jacobsen, Chris, Gammel, Peter L., Huggins, Harold, Ustin, Scott, Bogart, Greg, Ocola, Leo

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News & views by Ade, H., Hitchcock, A. P., Mitchell, G. E., Kilcoyne, A. L. D., Tyliszczak, T., Fink, R., Warwick, T., Evans-Lutterodt, Kenneth, Stein, Aaron, Ablett, James M., Kao, And Chi-Chang, Tennant, Don M., Klemens, Fred, Taylor, Ashley, Jacobsen, Chris, Gammel, Peter L., Huggins, Harold, Ustin, Scott, Bogart, Greg, Ocola, Leo

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