Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards by Klimtová, Markéta, Veselý, Petr, Králová, Iva, Dušek, Karel

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Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type by Králová, Iva, Pilnaj, Dominik, Pop-Georgievski, Ognen, Uřičář, Jonáš, Veselý, Petr, Klimtová, Markéta, Dušek, Karel

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3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties by Zdrahal, Jakub, Klimtova, Marketa, Kralova, Iva

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Effects of Thermal Cycling and PCB Substrate Type on Reliability of Solder Joints by Fros, Denis, Klimtova, Marketa, Kralova, Iva

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Electrochemical Migration: What Happens If a Drink Is Spilled on a Computer? by Vesely, Petr, Senkyr, Jaroslav, Klimtova, Marketa, Dusek, Karel

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Effect of TiO2 Nanoparticles Addition on the Electrochemical Migration of Lead-Free Sn-Bi Alloys by Dayoub, Ali, Gharaibeh, Ali, Tamasi, Patrik, Vesely, Petr, Klimtova, Marketa, Kralova, Iva, Dusek, Karel, Medgyes, Balint

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Electrochemical Migration Resistance of Gold Surface Finishes by Klimtova, Marketa, Vesely, Petr, Kralova, Iva, Wong, Yew Hoong, Faizul Mohd Sabri, Mohd, Dusek, Karel

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Influence of Reflow Temperature Profile on the Intermetallic Layers Thickness at Different Surface Finishes by Dusek, Karel, Vesely, Petr, Busek, David, Fros, Denis, Kralova, Iva, Klimtova, Marketa, Pilnaj, Dominik, Uricar, Jonas, Plachy, Zbynek, Sorokina, Kristina, Hintermuller, Jan, Dayoub, Ali, Medgyes, Balint, Krammer, Oliver, Geczy, Attila, Illes, Balazs

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