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Dynamic Cycling Contact Angle Measurements: Study of Advancing and Receding Contact Angles
by
Lam, C.N.C.
,
Ko, R.H.Y.
,
Yu, L.M.Y.
,
Ng, A.
,
Li, D.
,
Hair, M.L.
,
Neumann, A.W.
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Journal of colloid and interface science
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Study of a new structured leadframe based CSP, Mini-LOC
by
Jui-Meng Jao
,
Tzong Dar Her
,
Chien Ping Huang
,
Ko, E.
,
Calub, G.
,
Lo, R.H.Y.
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Journal Of Colloid And Interface Science
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Advancing Contact Angle
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Assembly
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Axisymmetric Drop Shape Analysis
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Chemistry
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Chemistry, Physical
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Chip Scale Packaging
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Contact Angle Hysteresis
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Dynamic Cycling Contact Angle
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Lead
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