Search Results - Kok-Yong Yiang

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  1. 1
    Stress migration model for Cu interconnect reliability analysis

    Stress migration model for Cu interconnect reliability analysis by Walter Yao, H., Yiang, Kok-Yong, Justison, Patrick, Rayasam, Mahidhar, Aubel, Oliver, Poppe, Jens

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  2. 2
    A simple electrical method for etch bias and process reliability determination

    A simple electrical method for etch bias and process reliability determination by Kok-Yong Yiang, Chin, M, Marathe, A, Aubel, O

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  3. 3
    Non-destructive current-ramp dielectric breakdown (IRDB) for fast BEOL reliability monitoring

    Non-destructive current-ramp dielectric breakdown (IRDB) for fast BEOL reliability monitoring by Kok-Yong Yiang, Francis, Rick, Marathe, Amit, Aubel, Oliver

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  4. 4
    New perspectives of dielectric breakdown in low-k interconnects

    New perspectives of dielectric breakdown in low-k interconnects by Kok-Yong Yiang, Yao, H.W., Marathe, A., Aubel, O.

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  5. 5
    Understanding the materials, electrical and reliability impact of Al-addition to ZrO2 for BEOL compatible MIM capacitors

    Understanding the materials, electrical and reliability impact of Al-addition to ZrO2 for BEOL compatible MIM capacitors by Triyoso, Dina H., Chu, Sanford, Seidel, Konrad, Weinreich, Wenke, Kok-Yong Yiang, Nolan, Mark G., Brunco, David P., Rinderknecht, Jochen, Utess, Dirk, Kyono, Carl, Miller, Rod, Jeasung Park, Lili Cheng, Liebau, Maik, Lomtscher, Patrick, Fox, Robert

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  6. 6
    TDDB Kinetics and their Relationship with the E- and √E-models

    TDDB Kinetics and their Relationship with the E- and √E-models by Yiang, Kok-Yong, Yao, H. Walter, Marathe, Amit

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