Search Results - Konarski, M.M.

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  1. 1
    Lead-free solder flip chip-on-laminate assembly and reliability

    Lead-free solder flip chip-on-laminate assembly and reliability by Zhenwei Hou, Guoyun Tian, Hatcher, C., Johnson, R.W., Yaeger, E.K., Konarski, M.M., Crane, L.

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  2. 2
    Underfilling fine pitch BGAs

    Underfilling fine pitch BGAs by Haiwei Peng, Johnson, R.W., Flowers, G.T., Ricketts, A.-G., Yeager, E.K., Konarski, M.M., Torres-Filho, A., Crane, L.

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    Processing and reliability of fast-flow, snap-cure underfills. I. Processing and moisture sensitivity

    Processing and reliability of fast-flow, snap-cure underfills. I. Processing and moisture sensitivity by Baldwin, D.F., Houston, P.N., Deladisma, M., Crane, L.N., Konarski, M.M.

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  4. 4
    Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity

    Processing and reliability of fast-flow, snap-cure underfills - Part I: processing and moisture sensitivity by Baldwin, D.F., Houston, P.N., Deladisma, M., Crane, L.N., Konarski, M.M.

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