Search Results - Krammer, O.

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  1. 1
    Analysis of no-clean flux spatter during the soldering process

    Analysis of no-clean flux spatter during the soldering process by Veselý, P., Bušek, D., Krammer, O., Dušek, K.

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  2. 2
    Digital Health Literacy and Information-Seeking Behavior among University College Students during the COVID-19 Pandemic: A Cross-Sectional Study from Denmark

    Digital Health Literacy and Information-Seeking Behavior among University College Students during the COVID-19 Pandemic: A Cross-Sectional Study from Denmark by Bak, Carsten K, Krammer, Jeanne Ø, Dadaczynski, Kevin, Orkan, Okan, von Seelen, Jesper, Prinds, Christina, Søbjerg, Lene M, Klakk, Heidi

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  3. 3
    Improved method for determining the shear strength of chip component solder joints

    Improved method for determining the shear strength of chip component solder joints by Krammer, O., Sinkovics, B.

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  4. 4
    Board level investigation of BGA solder joint deformation strength

    Board level investigation of BGA solder joint deformation strength by Sinkovics, B., Krammer, O.

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  5. 5
    Status Report of Training Development in the METIS Project Focusing on Test and Validation

    Status Report of Training Development in the METIS Project Focusing on Test and Validation by Medgyes, B., Illes, B., Krammer, O., Afsar, M.

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  6. 6
    Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards

    Solder Paste Scooping Detection by Multilevel Visual Inspection of Printed Circuit Boards by Benedek, C., Krammer, O., Janoczki, M., Jakab, L.

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  7. 7
    Curriculum and Training Development in the METIS project

    Curriculum and Training Development in the METIS project by Medgyes, B., Illes, B., Krammer, O., Tzanova, S., Gavra, S.

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  8. 8
    Investigating the effect of squeegee attack angle on the solder paste pressure during stencil printing

    Investigating the effect of squeegee attack angle on the solder paste pressure during stencil printing by Krammer, Oliver

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  9. 9
    Investigating the mechanical strength of Vapor Phase soldered chip components joints

    Investigating the mechanical strength of Vapor Phase soldered chip components joints by Krammer, O, Garami, T

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  10. 10
    Data driven approach to quality assessment of 3D printed electronic products

    Data driven approach to quality assessment of 3D printed electronic products by Tourloukis, Georgios, Stoyanov, Stoyan, Tilford, Tim, Bailey, Chris

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  11. 11
    Perspective methods of creating conductive paths by Aerosol Jet Printing technology

    Perspective methods of creating conductive paths by Aerosol Jet Printing technology by Navratil, Jiri, Hamacek, Ales, Reboun, Jan, Soukup, Radek

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  12. 12
    Investigating micro-alloyed solders with thermal shock tests

    Investigating micro-alloyed solders with thermal shock tests by Garami, T., Krammer, O.

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  13. 13
    Analysis and optimization of a geothermal, biomass, solar hybrid system: An application of PVSol software

    Analysis and optimization of a geothermal, biomass, solar hybrid system: An application of PVSol software by Patarau, Toma, Petreus, Dorin, Etz, Radu

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  14. 14
    Reliability comparison of Infrared and Vapour Phase soldering

    Reliability comparison of Infrared and Vapour Phase soldering by Krammer, O., Nagy, M.

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  15. 15
    Investigating the effect of nitrogen atmosphere on lead-free solder wetting angle

    Investigating the effect of nitrogen atmosphere on lead-free solder wetting angle by Krammer, O., Puskas, L.

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  16. 16
    Effect of multiple reflow cycles on intermetallic compound creation

    Effect of multiple reflow cycles on intermetallic compound creation by Wirth, Vaclav, Rendl, Karel, Steiner, Frantisek

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  17. 17
    Pupil centre coordinates detection using the circular Hough transform technique

    Pupil centre coordinates detection using the circular Hough transform technique by Bozomitu, Radu Gabriel, Pasarica, Alexandru, Cehan, Vlad, Rotariu, Cristian, Barabasa, Constantin

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  18. 18
    Comparison of the surface properties of power electronic substrates

    Comparison of the surface properties of power electronic substrates by Hromadka, Karel, Reboun, Jan, Rendl, Karel, Wirth, Vaclav, Hamacek, Ales

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  19. 19
    Aerosol Jet® printing of optical waveguides

    Aerosol Jet® printing of optical waveguides by Reitberger, Thomas, Hoerber, Johannes, Schramm, Rene, Sennefelder, Simon, Franke, Joerg

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  20. 20
    Corrosion investigations on lead-free micro-alloyed solder alloys used in electronics

    Corrosion investigations on lead-free micro-alloyed solder alloys used in electronics by Medgyes, Balint, Tamasi, Patrik, Hajdu, Ferenc, Muranyi, Roland, Lakatos-Varsanyi, Magda, Gal, Laszlo, Harsanyi, Gabor

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