CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

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Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size by Zhang, Zheng, Chen, Chuantong, Liu, Guiming, Li, Caifu, Kurosaka, Seigo, Nagao, Shijo, Suganuma, Katsuaki

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Prominent interface structure and bonding material of power module for high temperature operation by Sugiura, Kazuhiko, Iwashige, Tomohito, Kawai, Jun, Tsuruta, Kazuhiro, Chuantong Chen, Nagao, Shijo, Hao Zhang, Sugahara, Tohru, Suganuma, Katsuaki, Kurosaka, Seigo, Sakuma, Yuichi, Oda, Yukinori

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Effect of annealing Co-W-P metallization substrate onto its resin adhesion by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

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Effect of Substrate Preheating Treatment on Thermal Reliability and Micro-Structure of Ag Paste Sintering on Au Surface Finish by Zhang, Zheng, Chen, Chuantong, Suganuma, Katsuaki, Kurosaka, Seigo

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