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Highly reliable enhanced nitride interface process of barrier low-k using ultra-thin SiN with moisture blocking capability
by
Usami, Tatsuya
,
Miura, Yukio
,
Nakamura, Tomoyuki
,
Tsuchiya, Hideaki
,
Kobayashi, Chikako
,
Ohto, Koichi
,
Hiroshima, Shoichi
,
Tanaka, Mikio
,
Kunishima, Hiroyuki
,
Ishizuka, Issei
,
Kuwajima, Teruhiro
,
Sakurai, Michio
,
Yokogawa, Shinji
,
Fujii, Kunihiro
Published in
Microelectronic engineering
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Microelectronic Engineering
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Subjects
Barrier Low-K
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Barriers
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Condensed Matter: Electronic Structure, Electrical, Magnetic, And Optical Properties
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Condensed Matter: Structure, Mechanical And Thermal Properties
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Devices
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Dielectric Breakdown And Space-Charge Effects
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Dielectric Properties Of Solids And Liquids
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Dielectrics, Piezoelectrics, And Ferroelectrics And Their Properties
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Diffusion In Nanoscale Solids
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Diffusion In Solids
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Electromigration
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Engineering
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Engineering, Electrical & Electronic
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Enhanced Nitride Interface
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Exact Sciences And Technology
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Microelectronics
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Moisture
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Moisture Blocking Capability
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Nanoscience & Nanotechnology
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Nitrides
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Backfile Package - Engineering And Technology [Yen]
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