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The effect of FSG stability at high temperature on stress-induced voiding in Cu dual-damascene interconnects
by
OH, Hyeok-Sang
,
CHUNG, Juhyuk
,
LEE, Jung-Woo
,
KANG, Ki-Ho
,
PARK, Dea-Gun
,
HAH, Sangrok
,
CHO, In-Soo
,
PARK, Kwang-Myeon
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Mechanisms of stress-induced voids in multi-level Cu interconnects
by
Byung-Lyul Park
,
Sang-Rok Hah
,
Chan-Geun Park
,
Dong-Kwon Jeong
,
Hong-Seong Son
,
Hyeok-Sang Oh
,
Ju-Hyuk Chung
,
Jeong-Lim Nam
,
Kwang-Myeon Park
,
Jae-Dong Byun
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