MEAM molecular dynamics study of lead free solder for electronic packaging applications by Dong, Hai, Fan, Lianhua, Moon, Kyoung-sik, Wong, C P, Baskes, M I

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Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint by Li, Jiaxiong, Wilson, John, Cheung, Dylan, Sun, Zhijian, Moon, Kyoung-Sik, Swaminathan, Madhavan, Wong, Ching-Ping

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Amplified response of drug-induced liver fibrosis immune cell co-culture in a 3D hepatic fibrosis model by Jung, Hyewon, Kyun, Mi-lang, Kwon, Ji-In, Kim, Jeongha, Kim, Ju-Kang, Park, Daeui, Lee, Yu Bin, Moon, Kyoung-Sik

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Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging by MOON, Kyoung-Sik, WONG, C. P, KIM, Soo-Hyung, HYUNG DO CHOI, HAN, Seung, HO GYU YOON, SUH, Kwang S

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Polyhedral oligomeric silsesquioxanes (POSS)-filled underfill with excellent high temperature performance by Ziyin Lin, Shunyi Lau, Kyoung-sik Moon, Wong, C. P.

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Self-patterning, pre-applied underfilling technology for stack-die packaging by Chia-Chi Tuan, Ziyin Lin, Yan Liu, Kyoung-Sik Moon, Ching-Ping Wong

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Investigation of Aromatic Voltage Stabilizers for Enhancing High Voltage Stability of Epoxy for Power Electronics by Li, Jiaxiong, Mohanalingam, Kathaperumal, Gupte, Omkar, Sun, Zhijian, Moon, Kyoung-sik, Wong, Ching-ping

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Epoxy/ Triazine Copolymer Resin System for High Temperature Encapsulant Applications by Li, Jiaxiong, Ren, Chao, Moon, Kyoung-sik, Wong, Ching-ping

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ZnO quantum dots-filled encapsulant for LED packaging by Yan Liu, Ziyin Lin, Xueying Zhao, Sehoon Yoo, Kyoung-sik Moon, Wong, C. P.

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Formulation and Processing of Conductive Polysulfide Sealants for Automotive and Aerospace Applications by Song, Bo, Wu, Fan, Moon, Kyoung-sik, Wong, C. P.

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A Low Loss Die-Embedded Glass Substrate for 140 GHz InP Power Amplifier Integration by Jia, Xiaofan, Li, Xingchen, Kim, Joon Woo, Moon, Kyoung-sik, Rodwell, Mark J.W., Swaminathan, Madhavan

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Robust, novel, and low cost superhydrophobic nanocomposites coating for reliability improvement of microelectronics by Yan Liu, Ziyin Lin, Kyoung-sik Moon, Wong, C. P.

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Synthesis of Boron Nitride Coated Silica Filler for Preparing Thermally Conductive Epoxy Composites by Li, Jiaxiong, Ren, Yanjuan, An, Dong, Moon, Kyoung-sik, Wong, Ching-ping

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Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect by Yi Li, Myung Jin Yim, Kyoung Sik Moon, Wong, C.P.

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Epoxy/h-BN composites for thermally conductive underfill material by Qizhen Liang, Yonghao Xiu, Wei Lin, Kyoung-Sik Moon, Wong, C.P.

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Ultra-high refractive index LED encapsulant by Chia-Chi Tuan, Ziyin Lin, Yan Liu, Kyoung-Sik Moon, Sehoon Yoo, Myong-Gi Jang, Ching-Ping Wong

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Processing and characterization of silver-filled conductive polysulfide sealants for aerospace applicationsElectronic supplementary information (ESI) available. See DOI: 10.1039/c8... by Song, Bo, Li, Jiaxiong, Wu, Fan, Patel, Shiv, Hah, Jinho, Wang, Xueqiao, Moon, Kyoung-sik, Wong, Ching-Ping

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Stretchable/printed RF devices via high-throughput, high-definability soft-lithography fabrication by Zhuo Li, Liyi Li, Kyoung-sik Moon, Fan Cai, Papapolymerous, John, Wong, C. P.

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Nano filler dispersion in polymer composites for electronic packaging by Zhuo Li, Yi Gao, Kyoung-Sik Moon, Tannenbaum, A., Wong, C. P.

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High refractive index and transparency nanocomposites as encapsulant for high brightness LED packaging by Yan Liu, Ziyin Lin, Xueying Zhao, Kyoung-sik Moon, Sehoon Yoo, Choi, J., Wong, C. P.

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