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Superfilling CVD of copper using a catalytic surfactant
by
Hyungsang Park
,
Wonyong Koh
,
Seung-Man Choi
,
Ki-Chul Park
,
Ho-Kyu Kang
,
Joo-Tae Moon
,
Kyuchan Shim
,
Hyunbae Lee
,
Ohgyum Kwon
,
Sangwon Kang
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Conference Proceedings
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Chemical Vapor Deposition
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Copper
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Engineering
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Engineering, Electrical & Electronic
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Filling
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Microelectronics
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Moon
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Research And Development
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Scanning Electron Microscopy
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Science & Technology
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Semiconductor Films
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Substrates
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Technology
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Wiring
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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