Search Results - Kyung-Il Ouh

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  1. 1
    Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength

    Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength by Park, Jongwoo, Cha, Hyun-Joon, Kim, Back-Sung, Jo, Yong-Bum, Park, June-Kyun, Kim, Sam-Young, Shin, Sang-Cheol, Shin, Man-Young, Ouh, Kyung-Il, Jeon, Hyungoo

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  2. 2
    Stress Evolution Related to Metal Routing in Submicron Multilevel Interconnects: Void and Extrusion

    Stress Evolution Related to Metal Routing in Submicron Multilevel Interconnects: Void and Extrusion by Jo, Yong-Bum, Park, Jongwoo, Park, June-Kyun, Ouh, Kyung-Il, Jeon, Hyun-Goo

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    Reduction of radiated emissions from semiconductor by using absorbent materials

    Reduction of radiated emissions from semiconductor by using absorbent materials by Soo-Hyung Kim, Seung-Bae Lee, Kyung-Il Ouh, Chae-Bog Rim, Kyoung-Sik Moon, Ho-Gyu Yoon, Tak-Jin Moon

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