Search Results - KyungMooon Kim

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    Advanced laminate carrier module warpage considerations for 32nm pb-free, FC PBGA package design and assembly

    Advanced laminate carrier module warpage considerations for 32nm pb-free, FC PBGA package design and assembly by Blackshear, E., Lombardi, T., Pompeo, F., Audet, J., KyungMooon Kim, YoungHyuk Jeong, JoonYoung Choi, JoonYeob Lee, ChangWoo Park, Kondo, K., Matsumoto, S., Miyazawa, Y.

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