A near-field-sensing transceiver for intrabody communication based on the electrooptic effect by Shinagawa, M., Fukumoto, M., Ochiai, K., Kyuragi, H.

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A novel semiconductor capacitive sensor for a single-chip fingerprint sensor/identifier LSI by Machida, K., Shigematsu, S., Morimura, H., Tanabe, Y., Sato, N., Shimoyama, N., Kumazaki, T., Kudou, K., Yano, M., Kyuragi, H.

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A pixel-level automatic calibration circuit scheme for capacitive fingerprint sensor LSIs by Morimura, H., Shigematsu, S., Shimamura, T., Machida, K., Kyuragi, H.

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A 120-GHz millimeter-wave MMIC chipset for future broadband wireless access applications by Kosugi, T., Shibata, T., Enoki, T., Muraguchi, M., Hirata, A., Nagatsuma, T., Kyuragi, H.

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MEMS fingerprint sensor immune to various finger surface conditions by Sato, N., Machida, K., Morimura, H., Shigematsu, S., Kudou, K., Yano, M., Kyuragi, H.

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A fingerprint verification algorithm using the differential matching rate by Hatano, T., Adachi, T., Shigematsu, S., Morimura, H., Onishi, S., Okazaki, Y., Kyuragi, H.

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Electrical characteristics of a WSix contact electrode with a WSixN diffusion barrier formed by using electron cyclotron resonance plasma nitridation by HIRATA, A, HOSOYA, T, MACHIDA, K, KYURAGI, H, AKIYA, H

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A electrostatic micromechanical switch for logic operation in multichip modules on Si by Hirata, Akihiko, Machida, Katsuyuki, Kyuragi, Hakaru, Maeda, Masahiko

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Tungsten-beryllium multilayer mirrors for soft x rays by Utsumi, Y, Kyuragi, H, Urisu, T, Maezawa, H

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Advanced Spin Coating Film Transfer and Hot-Pressing Process for Global Planarization with Dielectric-Material-Viscosity Control by Sato, Norio, Machida, Katsuyuki, Yano, Masaki, Kudou, Kazuhisa, Kyuragi, Hakaru

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A Sealing Technique for Stacking MEMS on LSI Using Spin-Coating Film Transfer and Hot Pressing by Sato, Norio, Ishii, Hiromu, Shigematsu, Satoshi, Morimura, Hiroki, Kamei, Toshikazu, Kudou, Kazuhisa, Yano, Masaki, Machida, Katsuyuki, Kyuragi, Hakaru

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Ultralow-voltage MTCMOS/SOI circuits for batteryless wireless system by Douseki, Kyuragi

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Ultralow-power CMOS/SOI LSI design for future mobile systems by Douseki, T., Yamada, J., Kyuragi, H.

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Synchrotron radiation-excited chemical vapor deposition of silicon nitride films from a SiH4+NH3 gas mixture by KYURAGI, H, URISU, T

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A electrostatic micromechanical switch for logic operation in multichip modules on Si: Special Issue based on contributions revised from the Technical Digest of the Twelfth IEEE In... by HIRATA, A, MACHIDA, K, KYURAGI, H, MAEDA, M

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Evaluation of Sensitivity on a Capacitive Fingerprint Sensor LSI with a Grounded Wall Structure by Morimura, Hiroki, Shigematsu, Satoshi, Shimamura, Toshishige, Sato, Norio, Machida, Katsuyuki, Kyuragi, Hakaru

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A New Fabrication Process for Low-Loss Millimeter-Wave Transmission Lines on Silicon by Ishii, Hiromu, Sahri, Nabil, Nagatsuma, Tadao, Machida, Katsuyuki, Saito, Kunio, Yagi, Shouji, Yano, Masaki, Kudo, Kazuhisa, Kyuragi, Hakaru

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Electrical Characteristics of a WSi x Contact Electrode with a WSi x  N  Diffusion Barrier Formed by Using Electron Cyclotron Resonance Plasma Nitridation by Hirata, A., Hosoya, T., Machida, K., Kyuragi, H., Akiya, H.

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A micromechanical switch as the logic elements for circuits in multi chip module on Si (MCM-Si) by Hirata, A., Machida, K., Kyuragi, H., Maeda, M.

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Synchrotron radiation-excited chemical vapor deposition of SixNyHz film by KYURAGI, H, URISU, T

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