Search Results - LAY KUAN TEH

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  1. 1
    An experimentally supported model for the origin of charge transport barrier in Zn(O,S)/CIGSSe solar cells

    An experimentally supported model for the origin of charge transport barrier in Zn(O,S)/CIGSSe solar cells by Chua, Rou Hua, Li, Xianglin, Walter, Thomas, Teh, Lay Kuan, Hahn, Thomas, Hergert, Frank, Mhaisalkar, Subodh, Wong, Lydia Helena

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  2. 2
    Layer Transfer Approach to Opaline Hetero Photonic Crystals

    Layer Transfer Approach to Opaline Hetero Photonic Crystals by Yan, Qingfeng, Teh, Lay Kuan, Shao, Qi, Wong, C. C, Chiang, Yet-Ming

    Published in Langmuir
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  3. 3
    Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages

    Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages by Teo, M., Mhaisalkar, S.G., Wong, E.H., Poi-Siong Teo, Wong, C.C., Kristine Ong, Chin Foo Goh, Lay Kuan Teh

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  4. 4
    Transition state annealing for defect control during colloidal self-assembly

    Transition state annealing for defect control during colloidal self-assembly by Koh, Yaw Koon, Teh, Lay Kuan, Wong, Chee Cheong

    Published in Thin solid films
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  5. 5
    Ion selective electrodes utilizing a ferrocyanide doped redox active screen-printed solid contact - impact of electrode response to conditioning

    Ion selective electrodes utilizing a ferrocyanide doped redox active screen-printed solid contact - impact of electrode response to conditioning by Cheong, Yi Heng, Ge, Liya, Zhao, Nahong, Teh, Lay Kuan, Lisak, Grzegorz

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  6. 6
    Modeling of the effect of Al2O3 interlayer on residual stress due to oxide scale in thermal barrier coatings

    Modeling of the effect of Al2O3 interlayer on residual stress due to oxide scale in thermal barrier coatings by LIMARGA, Andi M, WIDJAJA, Sujanto, TICK HON YIP, LAY KUAN TEH

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  7. 7
    Characterization of nonconductive adhesives for flip-chip interconnection

    Characterization of nonconductive adhesives for flip-chip interconnection by LAY KUAN TEH, CHEE CHEONG WONG, MHAISALKAR, Subodh, ONG, Kristine, POI SIONG TEO, EE HUA WONG

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  8. 8
    Modeling of the effect of Al 2O 3 interlayer on residual stress due to oxide scale in thermal barrier coatings

    Modeling of the effect of Al 2O 3 interlayer on residual stress due to oxide scale in thermal barrier coatings by Limarga, Andi M, Widjaja, Sujanto, Yip, Tick Hon, Teh, Lay Kuan

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  9. 9
    Genetic variants of HBS1L-MYB with Hb subtypes level among Filipino β°-deletion carriers co-inherited with −α3.7 deletion thalassaemia

    Genetic variants of HBS1L-MYB with Hb subtypes level among Filipino β°-deletion carriers co-inherited with −α3.7 deletion thalassaemia by Lim, Lay Ngor, Teh, Lai Kuan, Yu, Koh Sam, Chua, Shi Min, George, Elizabeth, Lai, Mei I, Wong, Lily

    Published in Meta Gene
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