Search Results - LEUTENBAUER, R

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  1. 1
    Integration of micro-mechatronics in automotive applications

    Integration of micro-mechatronics in automotive applications by ANSORGE, F, BECKER, K.-F, MICHEL, B, LEUTENBAUER, R, GROBER, V, ASCHENBRENNER, R, REICHL, H

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  2. 2
    A highly flexible design and production framework for modularized microelectromechanical systems

    A highly flexible design and production framework for modularized microelectromechanical systems by Schuenemann, M., Grosser, V., Leutenbauer, R., Bauer, G., Schaefer, W., Reichl, H.

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  3. 3
    Selectively released microstructures electroplated into thick positive photoresist

    Selectively released microstructures electroplated into thick positive photoresist by Engelmann, G, Ehrmann, O, Leutenbauer, R, Schmitz, H, Reichl, H

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  4. 4
    Do chip size limits exist for DCA?

    Do chip size limits exist for DCA? by Schubert, A., Dudek, R., Leutenbauer, R., Doring, R., Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D.F., Jianmin Qu, Sitaraman, S.K., Swaminathan, M., Wong, C.P., Tummala, R.

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  5. 5
    MEMS modular packaging and interfaces

    MEMS modular packaging and interfaces by Schuenemann, M., Jam, K.A., Grosser, V., Leutenbauer, R., Bauer, G., Schaefer, W., Reichl, H.

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  6. 6
    The development of a top-bottom-BGA (TB-BGA)

    The development of a top-bottom-BGA (TB-BGA) by Leutenbauer, R., Grosser, V., Michel, B., Reichl, H.

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  7. 7
    Numerical and experimental investigations of large IC flip chip attach

    Numerical and experimental investigations of large IC flip chip attach by Schubert, A., Dudek, R., Leutenbauer, R., Coskina, P., Becker, K.-F., Kloeser, J., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Wong, C.P., Tummala, R.

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  8. 8
    The development of a top-bottom-BGA (TB-BGA)

    The development of a top-bottom-BGA (TB-BGA) by Leutenbauer, R., Grosser, V., Michel, B., Reichl, H.

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  9. 9
    A highly flexible design and production framework for modularized microelectromechanical systems: Special Issue of the Micromechanics Section of Sensors and Actuators, based on contributions revised from the Technical Digest of the Eleventh IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-98), Heidelberg, Germany, 25-29 January 1998

    A highly flexible design and production framework for modularized microelectromechanical systems: Special Issue of the Micromechanics Section of Sensors and Actuators, based on con... by SCHUENEMANN, M, GROSSER, V, LEUTENBAUER, R, BAUER, G, SCHAEFER, W, REICHL, H

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  10. 10
    Reliability of thermally aged Au and Sn plated copper leads for TAB inner lead bonding

    Reliability of thermally aged Au and Sn plated copper leads for TAB inner lead bonding by Zakel, E., Leutenbauer, R., Reichl, H.

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  11. 11
    A highly flexible design and production framework for modularized microelectromechanical systems

    A highly flexible design and production framework for modularized microelectromechanical systems by Schuenemann, M., Grosser, V., Leutenbauer, R., Bauer, G., Schaefer, W., Reichl, H.

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  12. 12
    Do chip size limits exist for DCA?

    Do chip size limits exist for DCA? by Schubert, A., Dudek, R., Leutenbauer, R., Doring, R., Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., Tummala, R.

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