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Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate
by
Yen, Yee-Wen
,
Chiang, Yu-Cheng
,
Jao, Chien-Chung
,
Liaw, Da-Wei
,
Lo, Shao-cheng
,
Lee, Chiapyng
Published in
Journal of alloys and compounds
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Thermal insulation of muscovite/glass ceramic foam for solid oxide fuel cell
by
Liaw, Da-Wei
,
Tsai, Chu-Yu
,
Wei, Wen-Cheng J.
Published in
Journal of power sources
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Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate
by
Yen, Yee-Wen
,
Liaw, Da-Wei
,
Chen, Kuen-Da
,
Chen, Hao
Published in
Journal of electronic materials
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Interfacial reactions and mechanical properties between Sn-4.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu-0.05Ni-0.01 Ge lead-free solders with the Au/Ni/Cu substrate
by
YEN, Yee-Wen
,
CHIANG, Yu-Cheng
,
JAO, Chien-Chung
,
LIAW, Da-Wei
,
LO, Shao-Cheng
,
LEE, Chiapyng
Published in
Journal of alloys and compounds
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Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate : Phase Stability, phase transformation and reactive phase formation in electro...
by
YEN, Yee-Wen
,
LIAW, Da-Wei
,
CHEN, Kuen-Da
,
HAO CHEN
Published in
Journal of electronic materials
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The effects of dual-task in patients with Parkinson’s disease performing cognitive-motor paradigms
by
Hsiu-Chen, Chang
,
Chiung-Chu, Chen
,
Jiunn-Woei, Liaw
,
Wei-Da, Chiou
,
Yi-Hsin, Weng
,
Ya-Ju, Chang
,
Chin-Song, Lu
Published in
Journal of clinical neuroscience
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Journal Of Alloys And Compounds
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Journal Of Electronic Materials
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Journal Of Clinical Neuroscience
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Journal Of Power Sources
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Au/Ni/Cu Multi-Layer
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Au/Ni/Sus304 Multilayer Substrate
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Brazing. Soldering
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Characterization And Evaluation Of Materials
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Chemistry And Materials Science
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