Percentage of signal intensity loss for characterisation of focal liver lesions in patients with chronic liver disease using ferucarbotran-enhanced MRI by CHOU, C.-T, CHEN, R.-C, CHEN, W.-T, LII, J.-M

Get full text

Detection of hepatocellular carcinoma by ferucarbotran-enhanced magnetic resonance imaging: the efficacy of accumulation phase fat-suppressed T1-weighted imaging by Chou, C.-T, Chen, R.-C, Chen, W.-T, Lii, J.-M

Get full text

Imaging well-differentiated hepatocellular carcinoma with dynamic triple-phase helical computed tomography by LI, C.-S, CHEN, R.-C, TU, H.-Y, SHIH, L.-S, ZHANG, T.-A, LII, J.-M, CHEN, W.-T, DUH, S.-J, CHIANG, L.-C

Get full text

Peritumoral fat-spared area is well correlated with the presence of temporal peritumoral enhancement in hepatic hemangioma in fatty liver by Chen, Ran-Chou, Li, Chao-Shiang, Lii, Jiunn-Ming, Chen, Wei-Tsung, Tu, Hsing-Yang

Get full text

New WLCSP scheme for device reliability improvement: YE: Yield enhancement/learning by Chang, Blenny, Huang, W. C., Ku, Harry, Lii, M. J., Chen, C. S., Wang, T. D., Chen, H. H., Chang, K. C.

Request full text

Dislocation modeling and acoustic emission observation of alternating ductile/brittle events in Fe-3wt%Si crystals by Lii, M.-J., Chen, X.-F., Katz, Y., Gerberich, W.W.

Get full text

Transcatheter arterial chemoembolization in patients with hepatocellular carcinoma and coexisting hepatic cavernous hemangioma by Chen, Ran-Chou, Lii, Jiunn-Ming, Chen, Wei-Tsung, Tu, Hsing-Yang, Chiang, Liang-Chung

Get full text

Solder joint reliability modeling for a 540-I/O plastic ball-grid-array assembly by Su, B., Hareb, S., Lee, Y.C., Lii, M.-J., Thurston, M.E.

Request full text

WLCSP Package and PCB Design for Board Level Reliability by Chiu, Jason, Chang, K.C., Hsu, Steven, Tsao, Pei-Haw, Lii, M.J.

Request full text

Advanced flip-chip package production solution for 40nm/28nm technology nodes by Chen, C S, Liu, C S, Lee, C H, Tsai, H Y, Pu, H P, Hsu, K C, Kuo, H J, Cheng, M D, Wu, C Y, Chiu, S L, Wu, K C, Chen, H W, Hsiao, C W, Tung, C H, Lii, M J, Yu, D C H

Request full text

Board Level Reliability Enhancement of WLCSP with Large Chip Size by Tsao, P. H., Lu, T. H., Chen, T. M., Chang, K. C., Kuo, C. M., Lii, M. J., Chu, L. H.

Request full text

Investigation of Production Quality and Reliability Risk of ELK Wafer WLCSP Package by Tsao, P. H., Chen, T. M., Kuo, Y. L., Kuo, C. M., Hsu, Steven, Lii, M. J., Chu, L. H.

Request full text

Process development to enable 3D IC multi-tier die bond for 20μM pitch and beyond by Hu, Y. H., Liu, C. S., Chen, M. T., Cheng, M. D., Kuo, H. J., Lii, M. J., La Manna, A., Rebibis, K. J., Wang, T., Huylenbroeck, S. V., Daily, R., Capuz, G., Velenis, D., Beyer, G., Beyne, E., Yu, Doug C. H.

Request full text

CPI challenges in advanced Si technology nodes by Liu, C. S., Pu, H. P., Chen, C. S., Tsai, H. Y., Lee, C. H., Lii, M. J., Yu, Doug C. H.

Request full text

3D stacking using Cu-Cu direct bonding by Hu, Y. H., Liu, C. S., Lii, M. J., Rebibis, K. J., Jourdain, A., Manna, A. L., Beyer, G., Beyne, E., Yu, C. H.

Request full text

3D stacking using Cu-Cu direct bonding for 40um pitch and beyond by Hu, Y. H., Liu, C. S., Lii, M. J., Manna, A. La, Rebibis, K. J., Zhao, M., Beyne, E., Yu, C.H.

Request full text

Cu-Cu hybrid bonding as option for 3D IC stacking by Hu, Y. H., Liu, C. S., Lii, M. J., Rebibis, K. J., Jourdain, A., La Manna, A., Beyne, E., Yu, C. H.

Request full text

Advanced flip-chip package solution for 28nm Si node and beyond by Liu, C. S., Chen, C. S., Lee, C. H., Tsai, H. Y., Pu, H. P., Cheng, M. D., Kuo, T. H., Chen, H. W., Wu, C. Y., Lii, M. J., Yu, D. C. H.

Request full text

Flip chip power cycling system development and lead free bump power cycling reliability by Wu, M. K. C., Pan, H. Y., Lin, L., Chiu, C., Chou, T., Lu, G., Liu, P., Wu, G., Pu, H. P., Tsai, H. Y., Kiang, B., Wu, K., Lii, M. J., Yu, C. H.

Request full text

Crack-tip dislocation emission arrangements for equilibrium —I. In situ TEM observations of Fe2wt%Si by Zielinski, W., Lii, M.J., Gerberich, W.W.

Get full text