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    Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses

    Water in contact with the backside of a silicon substrate enables drilling of high-quality holes through the substrate using ultrashort laser pulses by Laakso, Miku J O, Pagliano, Simone, Shah, Umer, Mårtensson, Gustaf E, Stemme, Göran, Niklaus, Frank

    Published in Optics express
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