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Search Results - Lam, Cheung-Wei
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Characterization of Harmonic Generation by Spring Contacts in Mobile Devices
by
Yang, Sen
,
Chen, Xiong
,
Mi, Rui
,
Lam, Cheung-Wei
,
Pommerenke, David
Published in
IEEE transactions on electromagnetic compatibility
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Nanosecond Peak Detect and Hold Circuit with Adjustable Dynamic Range
by
Fellner, Gabriel
,
Speckbacher, Lucas
,
Mousavi, Seyed Mostafa
,
Pommerenke, David Johannes
,
Shinde, Satyajeet
,
Hillstrom, Michael
,
Chundru, Ram
,
Lam, Cheung-Wei
Published in
IEEE transactions on instrumentation and measurement
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Quantification of Self-Damping of Power MOSFET in a Synchronous Buck Converter
by
Keong Kam
,
Pommerenke, D.
,
Bhargava, A.
,
Steinfeld, B.
,
Cheung-wei Lam
,
Centola, F.
Published in
IEEE transactions on electromagnetic compatibility
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An evaluation of TVS devices for ESD protection
by
Chundru, Ram
,
Li, Zhen
,
Pommerenke, David
,
Kam, Keong
,
Lam, Cheung-Wei
,
Centola, Federico
,
Steinfeld, Robert
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EMC guideline for synchronous buck converter design
by
Kam, K.
,
Pommerenke, D.
,
Centola, F.
,
Cheung-wei Lam
,
Steinfeld, R.
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EMI prediction in switched power supplies by full-wave and non-linear circuit co-simulation
by
Bhargava, A.
,
Pommerenke, D.
,
Keong Kam
,
Xin Chang
,
Centola, F.
,
Cheung-Wei Lam
,
Steinfeld, R.
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Quantifying EMI resulting from finite-impedance reference planes
by
Hockanson, D.M.
,
Dreniak, J.L.
,
Hubing, T.H.
,
van Doren, T.P.
,
Fei Sha
,
Cheung-Wei Lam
Published in
IEEE transactions on electromagnetic compatibility
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Modeling the nonlinearity of superconducting strip transmission lines
by
Lam, C.-W.
,
Sheen, D.M.
,
Ali, S.M.
,
Oates, D.E.
Published in
IEEE transactions on applied superconductivity
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EMI analysis methods for synchronous buck converter EMI root cause analysis
by
Kam, K.W.
,
Pommerenke, D.
,
Cheung-Wei Lam
,
Steinfeld, R.
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Fixture Design for Parasitic Capacitances of MOSFETs for EMI Applications
by
Huang, Anfeng
,
Zhang, Hanyu
,
Du, Li
,
Lam, Cheung-Wei
,
Hwang, Chulsoon
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Three-dimensional modeling of multichip module interconnects
by
Cheung-Wei Lam
,
Ali, S.M.
,
Nuytkens, P.
Published in
IEEE transactions on components, hybrids, and manufacturing technology
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