A Reconfigurable Baseband Platform Based on an Asynchronous Network-on-Chip by Lattard, D., Beigne, E., Clermidy, F., Durand, Y., Lemaire, R., Vivet, P., Berens, F.

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IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management by Vivet, Pascal, Guthmuller, Eric, Thonnart, Yvain, Pillonnet, Gael, Fuguet, Cesar, Miro-Panades, Ivan, Moritz, Guillaume, Durupt, Jean, Bernard, Christian, Varreau, Didier, Pontes, Julian, Thuries, Sebastien, Coriat, David, Harrand, Michel, Dutoit, Denis, Lattard, Didier, Arnaud, Lucile, Charbonnier, Jean, Coudrain, Perceval, Garnier, Arnaud, Berger, Frederic, Gueugnot, Alain, Greiner, Alain, Meunier, Quentin L., Farcy, Alexis, Arriordaz, Alexandre, Cheramy, Severine, Clermidy, Fabien

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A Telecom Baseband Circuit based on an Asynchronous Network-on-Chip by Lattard, Didier, Beigne, Edith, Bernard, Christian, Bour, Catherine, Clermidy, Fabien, Durand, Yves, Durupt, Jean, Varreau, Didier, Vivet, Pascal, Penard, Pierre, Bouttier, Arnaud, Berens, Friedbert

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M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC by Thuries, Sebastien, Billoint, Olivier, Choisnet, Sylvain, Lemaire, Romain, Vivet, Pascal, Batude, Perrine, Lattard, Didier

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A 4 x 4 x 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links by Vivet, Pascal, Thonnart, Yvain, Lemaire, Romain, Santos, Cristiano, Beigné, Edith, Bernard, Christian, Darve, Florian, Lattard, Didier, Miro-Panades, Ivan, Dutoit, Denis, Clermidy, Fabien, Chéramy, Séverine, Sheibanyrad, Abbas, Pétrot, Frédéric, Flamand, Eric, Michailos, Jean, Arriordaz, Alexandre, Wang, Lee, Schloeffel, Juergen

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An asynchronous hierarchical router for networks-on-chip-based three-dimensional multi-processor system-on-chip by Lafi, Walid, Lattard, Didier, Jerrya, Ahmed

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An energy-efficient IEEE 802.15.4 tunable digital baseband targeting self-adaptive WPANs by Lenoir, Vincent, Lattard, Didier, Jerraya, Ahmed

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A 4 \times 4 \times 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links by Vivet, Pascal, Thonnart, Yvain, Lemaire, Romain, Santos, Cristiano, Beigne, Edith, Bernard, Christian, Darve, Florian, Lattard, Didier, Miro-Panades, Ivan, Dutoit, Denis, Clermidy, Fabien, Cheramy, S., Sheibanyrad, Abbas, Petrot, Frederic, Flamand, Eric, Michailos, Jean, Arriordaz, Alexandre, Lee Wang, Schloeffel, Juergen

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Advanced 3D Technologies and Architectures for 3D Smart Image Sensors by Vivet, Pascal, Sicard, Gilles, Millet, Laurent, Chevobbe, Stephane, Chehida, Karim Ben, Angel Cubero, Luis, Alegre, Monte, Bouvier, Maxence, Valentian, Alexandre, Lepecq, Maria, Dombek, Thomas, Bichler, Olivier, Thuries, Sebastien, Lattard, Didier, Severine, Cheramy, Batude, Perrine, Clermidy, Fabien

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2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficien... by Vivet, Pascal, Guthmuller, Eric, Thonnart, Yvain, Pillonnet, Gael, Moritz, Guillaume, Miro-Panades, Ivan, Fuguet, Cesar, Durupt, Jean, Bernard, Christian, Varreau, Didier, Pontes, Julian, Thuries, Sebastien, Coriat, David, Harrand, Michel, Dutoit, Denis, Lattard, Didier, Arnaud, Lucile, Charbonnier, Jean, Coudrain, Perceval, Garnier, Arnaud, Berger, Frederic, Gueugnot, Alain, Greiner, Alain, Meunier, Quentin, Farcy, Alexis, Arriordaz, Alexandre, Cheramy, Severine, Clermidy, Fabien

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Heterogeneous vs homogeneous MPSoC approaches for a Mobile LTE modem by Jalier, Camille, Lattard, Didier, Jerraya, Ahmed Amine, Sassatelli, Gilles, Benoit, Pascal, Torres, Lionel

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An efficient hierarchical router for large 3D NoCs by Lafi, W, Lattard, D, Jerraya, A

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8.1 a 4x4x2 homogeneous scalable 3d network-on-chip circuit with 326mflit/s 0.66pj/b robust and fault-tolerant asynchronous 3d links by Vivet, Pascal, Thonnart, Yvain, Lemaire, Romain, Beigne, Edith, Bernard, Christian, Darve, Florian, Lattard, Didier, Miro-Panades, Ivan, Santos, Cristiano, Clermidy, Fabien, Cheramy, Severine, Petrot, Frederic, Flamand, Eric, Michailos, Jean

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Flexible and distributed real-time control on a 4G telecom MPSoC by Jalier, C, Lattard, D, Sassatelli, G, Benoit, P, Torres, L

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BISTs for post-bond test and electrical analysis of high density 3D interconnect defects by Jani, Imed, Lattard, Didier, Vivet, Pascal, Arnaud, Lucile, Beigne, Edith

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Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle by Jani, Imed, Lattard, Didier, Vivet, Pascal, Arnaud, Lucile, Cheramy, Severine, Beigne, Edith, Farcy, Alexis, Jourdon, Joris, Henrion, Yann, Deloffre, Emilie, Bilgen, Halim

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Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning by Jani, Imed, Lattard, Didier, Vivet, Pascal, Durupt, Jean, Thuries, Sebastien, Beigne, Edith

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Trends in complex SoC Design: From technology variability to multiprocessor architectures by Lattard, Didier

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A Homogeneous MPSoC with Dynamic Task Mapping for Software Defined Radio by Jalier, C, Lattard, D, Sassatelli, G, Benoit, P, Torres, L

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High level modelling and performance evaluation of address mapping in NAND flash memory by Lafi, W., Lattard, D., Jerraya, A.

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