Ensemble Learning for Multi-Label Classification with Unbalanced Classes: A Case Study of a Curing Oven in Glass Wool Production by Ho, Minh Hung, Ponchet Durupt, Amélie, Vu, Hai Canh, Boudaoud, Nassim, Caracciolo, Arnaud, Sieg-Zieba, Sophie, Xu, Yun, Leduc, Patrick

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Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration by Gueguen, Pierric, Ventosa, Caroline, Cioccio, Léa Di, Moriceau, Hubert, Grossi, François, Rivoire, Maurice, Leduc, Patrick, Clavelier, Laurent

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Fabrication of three-dimensional electrical connections by means of directed actin self-organization by Galland, Rémi, Leduc, Patrick, Guérin, Christophe, Peyrade, David, Blanchoin, Laurent, Théry, Manuel

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System on Wafer: A New Silicon Concept in SiP by Poupon, Gilles, Batude, Perrine, Sillon, Nicolas, Henry, David, Gillot, Charlotte, Mathewson, Alan, Di Cioccio, Lea, Charlet, Barbara, Leduc, Patrick, Vinet, Maud

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Solution chemistry effects on cracking and damage evolution during chemical-mechanical planarization by Ong, Markus D., Leduc, Patrick, McKenzie, Daniel W., Farjot, Thierry, Passemard, Gerard, Maitrejean, Sylvain, Dauskardt, Reinhold H.

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Electromigration behavior of 3D-IC TSV interconnects by Frank, T., Moreau, S., Chappaz, C., Arnaud, L., Leduc, P., Thuaire, A., Anghel, L.

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System on Wafer: A New Silicon Concept in SiP : With this flexible, low-cost, high-yield packaging technique, which can be implemented by various technologies, components and chips... by POUPON, Gilles, SILLON, Nicolas, HENRY, David, GILLOT, Charlotte, MATHEWSON, Alan, DI CIOCCIO, Lea, CHARLET, Barbara, LEDUC, Patrick, VINET, Maud, BATUDE, Perrine

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Panel: "Will 3D-IC remain a technology of the future... Even in the future?" by Casale-Rossi, Marco, Leduc, Patrick, De Micheli, Giovanni, Blouet, Patrick, Farley, Brendan, Fontanelli, Anna, Milojevic, Dragomir, Smith, Steve

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Dependence of CMP-induced delamination on number of low-k dielectric films stacked by Leduc, Patrick, Farjot, Thierry, Savoye, Mylène, Demas, Anne-Cécile, Maitrejean, Sylvain, Passemard, Gérard

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Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking by Cadix, Lionel, Fuchs, Christine, Rousseau, Maxime, Leduc, Patrick, Chaabouni, Hamed, Thuaire, Aurelie, Brocard, Melanie, Valentian, Alexandre, Farcy, Alexis, Bermond, Cedric, Sillon, Nicolas, Ancey, Pascal, Fléchet, Bernard

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A novel FDSOI transistor based uncooled microbolometer sensor for disruptive IRFPAs by Albouy, Antoine, Yon, Jean-Jacques, Leduc, Patrick, Dumont, Geoffroy, Aliane, Abdelkader, Balestra, Francis

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Erratum to: Vortex dynamics in confined counter-current shearing flows with applications to mixing [Inter. J. Heat Fluid Flow 29 (2008) 1089–1102] by Humphrey, Joseph A.C., Rosales, Jorge L., Legendre, Lindsay A., LeDuc, J. Patrick, Landers, James P., Pillapakkam, S.

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Vortex dynamics in confined counter-current shearing flows with applications to mixing by Humphrey, Joseph A.C., Rosales, Jorge L., Legendre, Lindsay A., LeDuc, J. Patrick, Landers, James P.

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Reliability approach of high density Through Silicon Via (TSV) by Frank, T, Chappaz, Cédrick, Leduc, P, Arnaud, L, Moreau, Stéphane, Thuaire, Aurélie, El Farhane, R, Anghel, L

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Investigation on TSV impact on 65nm CMOS devices and circuits by Chaabouni, H, Rousseau, M, Leduc, P, Farcy, A, El Farhane, R, Thuaire, A, Haury, G, Valentian, A, Billiot, G, Assous, M, De Crecy, F, Cluzel, J, Toffoli, A, Bouchu, D, Cadix, L, Lacrevaz, T, Ancey, P, Sillon, N, Flechet, B

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Panel: "will 3D-IC remain a technology of the future... even in the future?" by Casale-Rossi, Marco, Leduc, Patrick, De Micheli, Giovanni, Blouet, Patrick, Farley, Brendan, Fontanelli, Anna, Milojevic, Dragomir, Smith, Steve

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Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits by Cadix, L., Farcy, A., Bermond, C., Fuchs, C., Leduc, P., Rousseau, M., Assous, M., Valentian, A., Roullard, J., Eid, E., Sillon, N., Flechet, B., Ancey, P.

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Challenges for 3D IC integration: bonding quality and thermal management by Leduc, Patrick, Sillon, Nicolas, Maitrejean, Sylvain, Louis, Didier, Passemard, Gerard, de Crecy, Francois, Fayolle, Murielle, Charlet, Barbara, Enot, Thierry, Zussy, Marc, Jones, Bob, Barbe, Jean-Charles, Kernevez, Nelly

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Some strategic tracks to optimize routing of high speed signal transmission between memory and logic in 3D–IC stacks by Roullard, Julie, Farcy, Alexis, Capraro, Stéphane, Lacrevaz, Thierry, Bermond, Cédric, Houzet, Gregory, Artillan, Philippe, Charbonnier, Jean, Fuchs, Christine, Ferrandon, Christine, Leduc, Patrick, Flechet, Bernard

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A successful implementation of dual damascene architecture to copper TSV for 3D high density applications by El Farhane, Rebha, Assous, M, Leduc, P, Thuaire, A, Bouchu, D, Feldis, H, Sillon, N

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