Search Results - Lee, Bongsub

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  1. 1
    Accessible determination of die-to-wafer bond strength with the Schwickerath test

    Accessible determination of die-to-wafer bond strength with the Schwickerath test by Shao, Shuai, Niu, Yuling, Wang, Jing, Park, Seungbae, Lee, Bongsub

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  2. 2
    The development of the CS valve used to the variable swash plate compressor for a vehicle air-conditioning system

    The development of the CS valve used to the variable swash plate compressor for a vehicle air-conditioning system by Taejin, Le, Lee, Bongsub, Lee, Geonho, Kyeong-Ho, Shin, Joo-Hyung, Kim

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  3. 3
    Deep Convolution Neural Networks for Automatic Detection of Defects which Impact Hybrid Bonding Yield

    Deep Convolution Neural Networks for Automatic Detection of Defects which Impact Hybrid Bonding Yield by Zhao, Oliver, Suwito, Dominik, Lee, Bongsub, Workman, Thomas, Mirkarimi, Laura

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  4. 4
    High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry

    High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry by Lee, Bongsub, Zhao, Oliver, Avellan, Arianna, Sadiq, Suhail, Fountain, Gill, Suwito, Dominik, Gao, Guilian, Mirkarimi, Laura

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  5. 5
    Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding

    Low Temperature Cu Interconnect with Chip to Wafer Hybrid Bonding by Gao, Guilian, Mirkarimi, Laura, Workman, Thomas, Fountain, Gill, Theil, Jeremy, Guevara, Gabe, Liu, Ping, Lee, Bongsub, Mrozek, Pawel, Huynh, Michael, Rudolph, Catharina, Werner, Thomas, Hanisch, Anke

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  6. 6
    The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding

    The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding by Mirkarimi, Laura, Uzoh, Cyprian, Suwito, Dominik, Lee, Bongsub, Fountain, Gill, Workman, Thomas, Theil, Jeremy, Gao, Guilian, Buckalew, Bryan, Oberst, Justin, Ponnuswamy, Thomas

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  7. 7
    Die to Wafer Stacking with Low Temperature Hybrid Bonding

    Die to Wafer Stacking with Low Temperature Hybrid Bonding by Gao, Guilian, Workman, Thomas, Uzoh, Cyprian, Bang, K. M., Mirkarimi, Laura, Theil, Jeremy, Suwito, Dominik, Katkar, Rajesh, Fountain, Gill, Guevara, Gabe, Lee, Bongsub

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  8. 8
    Die to Wafer Hybrid Bonding and Fine Pitch Considerations

    Die to Wafer Hybrid Bonding and Fine Pitch Considerations by Workman, Thomas, Mirkarimi, Laura, Theil, Jeremy, Fountain, Gill, Bang, KM, Lee, Bongsub, Uzoh, Cyprian, Suwito, Dominik, Gao, Guilian, Mrozek, Pawel

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  9. 9
    Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications

    Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications by Gao, Guilian, Mirkarimi, Laura, Fountain, Gill, Suwito, Dominik, Theil, Jeremy, Workman, Thomas, Uzoh, Cyprian, Lee, Bongsub, Bang, K.M., Guevara, Gabe

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  10. 10
    Fine Pitch Die-to-Wafer Hybrid Bonding

    Fine Pitch Die-to-Wafer Hybrid Bonding by Mirkarimi, Laura, Workman, Thomas, Theil, Jeremy, Fountain, Gill, Bang, KM, Zhao, Oliver, Lee, Bongsub, Uzoh, Cyprian, Suwito, Dominik, Gao, Guilian

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  11. 11
    Nanoscale Topography Characterization for Direct Bond Interconnect

    Nanoscale Topography Characterization for Direct Bond Interconnect by Lee, Bongsub, Mrozek, Pawel, Fountain, Gill, Posthill, John, Theil, Jeremy, Gao, Guilian, Katkar, Rajesh, Mirkarimi, Laura

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  12. 12
    Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks

    Analysis of Die Edge Bond Pads in Hybrid Bonded Multi-Die Stacks by Theil, Jeremy A., Workman, Thomas, Suwito, Dominik, Mirkarimi, Laura, Fountain, Gill, Bang, KM, Gao, Guilian, Lee, Bongsub, Mrozek, Pawel, Uzoh, Cyprian, Huynh, Michael, Zhao, Oliver

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  13. 13
    Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications

    Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications by Gao, Guilian, Mirkarimi, Laura, Fountain, Gill, Suwito, Dominik, Theil, Jeremy, Workman, Thomas, Uzoh, Cyprian, Guevara, Gabe, Lee, Bongsub, Huyhn, Michael, Mrozek, Pawel

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  14. 14
    Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding

    Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding by Guilian Gao, Mirkarimi, Laura, Fountain, Gill, Liang Wang, Uzoh, Cyprian, Workman, Thomas, Guevara, Gabe, Mandalapu, Chandrasekhar, Lee, Bongsub, Katkar, Rajesh

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  15. 15
    Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications

    Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications by Lee, Bongsub, Katkar, Rajesh, Gao, Guilian, Fountain, Gill, Lee, Sangil, Wang, Liang, Mandalapu, Chandrasekhar, Uzoh, Cyprian, Mirkarimi, Laura, Sykes, Bob, Litjens, Max, Niu, Yuling, Shao, Shuai, Wang, Jing, Park, Seungbae

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  16. 16
    Plasma heating characterization of the large area inductively coupled plasma etchers with the plasma information for managing the mass production

    Plasma heating characterization of the large area inductively coupled plasma etchers with the plasma information for managing the mass production by Park, Seolhye, Park, Yoona, Seong, Jaegu, Lee, Haneul, Bae, Namjae, Roh, Ki-baek, Seo, Rabul, Song, Bongsub, Kim, Gon-Ho

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  17. 17
    High Frame-Rate VGA CMOS Image Sensor Using Non-Memory Capacitor Two-Step Single-Slope ADCs

    High Frame-Rate VGA CMOS Image Sensor Using Non-Memory Capacitor Two-Step Single-Slope ADCs by Lee, Junan, Park, Himchan, Song, Bongsub, Kim, Kiwoon, Eom, Jaeha, Kim, Kyunghoon, Burm, Jinwook

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  18. 18
    Data-driven plasma science based plasma etching process design in OLED mass production referring to PI-VM

    Data-driven plasma science based plasma etching process design in OLED mass production referring to PI-VM by Park, Seolhye, Seong, Jaegu, Park, Yoona, Noh, Yeongil, Lee, Haneul, Bae, Namjae, Roh, Ki-Baek, Seo, Rabul, Song, Bongsub, Kim, Gon-Ho

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  19. 19
    A 0.18-$\mu$m CMOS 10-Gb/s Dual-Mode 10-PAM Serial Link Transceiver

    A 0.18-$\mu$m CMOS 10-Gb/s Dual-Mode 10-PAM Serial Link Transceiver by Song, Bongsub, Kim, Kyunghoon, Lee, Junan, Burm, Jinwook

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  20. 20
    A 13.5-mW 10-Gb/s 4-PAM Serial Link Transmitter in 0.13- \mu\hbox CMOS Technology

    A 13.5-mW 10-Gb/s 4-PAM Serial Link Transmitter in 0.13- \mu\hbox CMOS Technology by Song, Bongsub, Kim, Kyunghoon, Lee, Junan, Chung, Jinil, Choi, Youngjung, Burm, Jinwook

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