C2W Hybrid Bonding Interconnect Technology for Higher Density and Better Thermal Dissipation of High Bandwidth Memory by Kim, Kibum, Lim, Sanghyuk, Jung, Dongwook, Choi, Jeongyun, Na, Song, Yeom, Jaehvun, Lee, Miseon, Kim, Jongyeon, Kwon, Jongoh, Moon, Ki-Il, Lee, Gyuje, Lee, Kangwook

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