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Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter
by
Kim, Taehyun
,
Han, Sangwug
,
Lee, Jubum
,
Na, Yeeun
,
Jung, Joontaek
,
Park, Yun Chang
,
Oh, Jaesub
,
Yang, Chungmo
,
Kim, Hee Yeoun
Published in
Micromachines (Basel)
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A highly manufacturable, low-thermal budget, void and seam free pre-metal-dielectric process using new SOG for beyond 60nm DRAM and other devices
by
Juseon Goo
,
Eunkee Hong
,
Hong-Gun Kim
,
Hyun Jo Kim
,
Eun Kyung Baek
,
Sun-Hoo Park
,
Jubum Lee
,
Hyeon Deok Lee
,
Ho-Kyu Kang
,
Joo-Tae Moon
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Conference Proceeding
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A High-Speed Sliding-Mode Observer for the Sensorless Speed Control of a PMSM
by
Kim, Hongryel
,
Son, Jubum
,
Lee, Jangmyung
Published in
IEEE transactions on industrial electronics (1982)
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Ieee Transactions On Industrial Electronics
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Copper
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