A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties by Jing-Feng Gong, Chan, P.C.H., Guo-Wei Xiao, Lee, R.S.W., Yuen, M.M.F.

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Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener by Guo-wei Xiao, Chan, P.C.H., Lee, R.S.W., Yuen, M.M.F.

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Design of shock table tests to mimic real-life drop conditions for portable electronic device by Zhou, C.Y., Yu, T.X., Lee, R.S.W.

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Effects of underfill adhesion on flip chip package reliability by Man-Lung Sham, Jang-Kyo Kim, Lee, R.S.W., Jingshen Wu, Yuen, M.M.F.

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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on ubm related intermetallic compound growth properties by Sing-Feng Gong, Guo-Wei Xiao, Chani, P.C.H., Lee, R.S.W., Yuen, M.M.F.

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Optimization of stencil printing wafer bumping for fine pitch flip chip applications by Jing-Feng Gong, Yau, E.W.C., Chan, P.C.H., Lee, R.S.W., Yuen, M.M.F.

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Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies by Guo-Wei Xiao, Jing-Feng Gong, Yau, E.W.C., Chan, P.C.H., Lee, R.S.W., Yuen, M.M.F.

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Global collaborative electronic packaging education by Tong, P., Lam, D.C.C., Yuen, M.M.F., Kim, J.K., Lee, R.S.W., Lee, S.H.K., Chan, P.

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Proceedings of a workshop to discuss the epidemiology of invasive Haemophilus influenzae disease with emphasis on serotype a and b in the Americas, 2019 by Cox, A.D., Kuo Lee, R., Ulanova, M., Bruce, M.G., Tsang, R.S.W.

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