Search Results - Lehtonen, S.J.

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  1. 1
    Wirebonding at higher ultrasonic frequencies: reliability and process implications

    Wirebonding at higher ultrasonic frequencies: reliability and process implications by Charles, H.K, Mach, K.J, Lehtonen, S.J, Francomacaro, A.S, DeBoy, J.S, Edwards, R.L

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  2. 2
    Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats

    Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats by Wesolek, D.M., Darrin, A.G., Osiander, R., Lehtonen, S.J., Edwards, R.L., Hererro, F.A.

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  3. 3
    Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates

    Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates by Francomacaro, A.S., Charles, H.K., Lehtonen, S.J., Keeney, A.C., Clatterbaugh, G.V., Banda, C.V.

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  4. 4
    High-frequency wirebonding: process and reliability implications

    High-frequency wirebonding: process and reliability implications by Charles, H.K., Mach, K.J., Lehtonen, S.J., Francomacaro, A.S., DeBoy, J.S., Edwards, R.L.

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  5. 5
    Wirebonding on various multichip module substrates and metallurgies

    Wirebonding on various multichip module substrates and metallurgies by Charles, H.K., Mach, K.J., Edwards, R.L., Lehtonen, S.J., Lee, D.M.

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  6. 6
    Wirebonding: reinventing the process for MCMs

    Wirebonding: reinventing the process for MCMs by Charles, H.K. Jr, Mach, K.J., Edwards, R.L., Lehtonen, S.J., Lee, D.M.

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  7. 7
    Evaluation of die coating materials for chip-on-board technology insertion in spaceborne applications

    Evaluation of die coating materials for chip-on-board technology insertion in spaceborne applications by Le, B.Q., Nhan, E., Maurer, R.H., Lew, A.L., Lander, J.R., Lehtonen, S.J., Garrison Darrin, M.A.

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