Search Results - Lekhanh Dang

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    Improving signal integrity of system packaging by back-drilling plated through holes in board assembly

    Improving signal integrity of system packaging by back-drilling plated through holes in board assembly by CAMERLO, Sergio, AHMAD, Bilal, YIDA ZOU, DANG, Lekhanh, HU, Mason, PRIORE, Scott

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    Cost and manufacturing optimization of high performance communication hardware using a daughter module

    Cost and manufacturing optimization of high performance communication hardware using a daughter module by Camerlo, S., Priore, S., Brillhart, M., Wheling Cheng, Lekhanh Dang, Chen, J.

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