Failure analysis of normally-off GaN HEMTs under avalanche conditions by Martínez, P J, Letz, S, Maset, E, Zhao, D

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Syntactical and semantical aspects of Faust by Orlarey, Y., Fober, D., Letz, S.

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Influence of SiC chip thickness on the power cycling capability of power electronics assemblies – A comprehensive numerical study by Zhao, D., Letz, S., Leib, J., Schletz, A.

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Mesostructural impact on the macroscopic stress state and yield locus of porous polycrystalline silver by Letz, S.A., Zhao, D., März, M.

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Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis by Du, H., Letz, S., Baker, N., Goetz, T., Iannuzzo, F., Schletz, A.

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Automated quantitative analysis of void morphology evolution in AgAg direct bonding interface after accelerated aging by Yu, Z., Xu, T., Letz, S., Bayer, C.F., Schletz, A., März, M.

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Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cyclin... by Zhao, D., Letz, S., Yu, Z., Schletz, A., März, M.

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Automated quantitative analysis of void morphology evolution in Ag Ag direct bonding interface after accelerated aging by Yu, Z., Xu, T., Letz, S., Bayer, C.F., Schletz, A., März, M.

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Functional verification of the IBM System z10 processor chipset by Krygowski, C A, Bair, D G, Gott, R M, Decker, M H, Giri, A V, Habermann, C, Heizmann, M, Letz, S, Lewis, W J, Licker, S M, Mallar, H, McCain, E C, Roesner, W, Siddique, N, Seigler, A E, Thompto, B W, Weber, K, Winkelmann, R

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Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles by Simon, F.B., Letz, S.A., Schletz, A.

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Modeling the rate-dependent inelastic deformation behavior of porous polycrystalline silver films by Letz, S.A., Farooghian, A., Simon, F.B., Schletz, A.

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Comments on “Hack proofing your network” by Letz, S

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The Telecommunications Handbook by Letz, S

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Real time musical events streaming over Internet by Fober, D., Orlarey, Y., Letz, S.

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Comments on “Hack proofing your network”: K Paulson; Syngress, 440 pages. ISBN 1928994156 by Letz, S

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The Telecommunications Handbook: K Terplan by Letz, S

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VEMUS: An Integrated Platform to Support Music Tuition Tasks by Tambouratzis, G., Perifanos, K., Voulgari, I., Askenfelt, A., Granqvist, S., Hansen, K.F., Orlarey, Y., Fober, D., Letz, S.

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Chicago Ironwork, Chicago, Cook County, IL by Historic American Buildings Survey

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Slovenský národný a politický mýtus by Letz, Róbert

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Slovenský národný a politický mýtus. Dlhá cesta dejinami by Letz, Róbert

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