Search Results - Leung, K.Y.K.

  • Showing 1 - 7 results of 7
Refine Results
  1. 1
    Decentralized Localization of Sparsely-Communicating Robot Networks: A Centralized-Equivalent Approach

    Decentralized Localization of Sparsely-Communicating Robot Networks: A Centralized-Equivalent Approach by Leung, K.Y.K., Barfoot, T.D., Liu, H.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    Markov-Based Lane Positioning Using Intervehicle Communication

    Markov-Based Lane Positioning Using Intervehicle Communication by Thanh-Son Dao, Leung, K.Y.K., Clark, C.M., Huissoon, J.P.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  3. 3
    Localization in urban environments by matching ground level video images with an aerial image

    Localization in urban environments by matching ground level video images with an aerial image by Leung, K.Y.K., Clark, C.M., Huissoon, J.P.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  4. 4
    Horizontal equity in health care utilization evidence from three high-income Asian economies

    Horizontal equity in health care utilization evidence from three high-income Asian economies by Lu, Jui-fen R., Leung, Gabriel M., Kwon, Soonman, Tin, Keith Y.K., Van Doorslaer, Eddy, O’Donnell, Owen

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Social disparities and cause-specific mortality during economic development

    Social disparities and cause-specific mortality during economic development by Mary Schooling, C., Lau, Elaine W.L., Tin, Keith Y.K., Leung, Gabriel M.

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  6. 6
    Hong Kong's health spending projections through 2033

    Hong Kong's health spending projections through 2033 by Leung, Gabriel M, Tin, Keith Y.K, Chan, Wai-Sum

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  7. 7
    Parametric study of electroplating-based via-filling process for TSV applications

    Parametric study of electroplating-based via-filling process for TSV applications by Tsui, K.Y.K., Yau, S.K., Leung, V.C.K., Sun, P., Shi, D.X.Q.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: