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Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material
by
Wang, Chao-Hong
,
Chiu, Chun-Wei
,
Li, Mei-Hau
Published in
Materials
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Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)2Te3 thermoelectric materials with Sn and Sn–Ag–Cu solders
by
Wang, Chao-hong
,
Li, Mei-hau
,
Chiu, Chun-wei
,
Chang, Tai-yu
Published in
Journal of alloys and compounds
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Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2Te3 Thermoelectric Material
by
Wang, Chao-hong
,
Li, Mei-hau
,
Chiu, Chun-wei
,
Wang, Xin-He
Published in
JOM (1989)
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Interfacial Reactions between Sn-Based Solders and n-Type Bi 2 (Te,Se) 3 Thermoelectric Material
by
Wang, Chao-Hong
,
Chiu, Chun-Wei
,
Li, Mei-Hau
Published in
Materials
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Interfacial Reactions between Sn-Based Solders and n-Type Bi[sub.2][sub.3] Thermoelectric Material
by
Wang, Chao-Hong
,
Chiu, Chun-Wei
,
Li, Mei-Hau
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Materials
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Kinetic study of solid-state interfacial reactions of p-type (Bi,Sb)^sub 2^Te^sub 3^ thermoelectric materials with Sn and Sn–Ag–Cu solders
by
Wang, Chao-hong
,
Li, Mei-hau
,
Chiu, Chun-wei
,
Chang, Tai-yu
Published in
Journal of alloys and compounds
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